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'  _ ; XX  DRAFT #XT"X ;J#  iAp)P dEP A dd&X0/&OLE 2.0 Box <=8C HKKKK '  _o  ; XX DRAFT #XT"X ;S#Ap)5 dE5 Ahttp://www.boulder.nist.gov/div853/lead%20free/props01.htmlX[Inline Te&xt" <<CLevel 1Level 2Level 3Level 4Level 56$ Horizontal LinesddTABLE A)Hairline d "   x<`  '  _c&M%XX  DRAFT #XT"X%&MG#Ap)t "dEt "A '  _   ; XX Ap) %dE %ADRAFT #XT"X ;S#ZXYC<<CLevel 1Level 2Level 3Level 4Level 5($$   1  4Times New Roman ItalicReferences: Page - -d  )  _WXXAp) "dE "AAbtAssociatesInc.0 : 0 :F%:F% 򀀀0B F% F%DRAFT: 0BF%BF%0JF%F%0JF%JF%0F%F%0RF%F%0RF%RF%December4,2002#XT"XWJ# 9 Z<`       >c$"Small Circle"0  " `  ` (www.nemi.org/PbFreePublic/)($$  0  www.nemi.org/pbfreepublic/http://www.nemi.org/newsroom/Presentations/index.htmlhttp://www.aimsolder.com/leadfree_tdss.cfm?section=assembly(3$ !    0  .  )  _cWXXAp)g "dEg "A_Abt_ԀAssociatesInc.0  0k S%S% 0 k S%k S%0 S% S%DRAFT :0S%S%0#S%S% { 0#S%#S%0+S%S%0+S%+S%December4,2002#XT"XWJ#TABLE A<+  Z$Symbol Regular 9   ZZ`     x _$    26    _#XXԀSeveralliteraturesourcescitedselectcharacteristicsforalloysthatdifferedincompositionfromthatmentioned.Such  compositionshavebeenincludedinparenthesesfollowingtheappropriatecomment.#XnX#T#(9 Z6Times New Roman Regular2dddXYM fdgsfd<< CTABLE U x _$    24    _#XXԀSeveralliteraturesourcescitedselectcharacteristicsforalloysthatdifferedincompositionfromthatmentioned.Such  compositionshavebeenincludedinparenthesesfollowingtheappropriatecomment.#XnX#T#ԈTABLE B @ _$    6    _VXXԀTheultimatetensilestrengthvaluesfallbetween19and56MPa(withanaverageof39.47MPa)aspertenreferencescitedbyLau  etal.,Table13.2.#XT"XVS# 7 _$    7    _VXXԀTheyieldstrengthvaluesfallbetween27.2and37MPa(withanaverageof30.62MPa)asperfourreferencescitedbyLauetal.,  Table13.2.#XT"XVS#  _$    8    _VXXԀTheelongationvaluesfallbetween31and52.87%(mean41.0%)aspersixreferencescitedbyLauetal.,Table13.2.#XT"XVS#  _$    9    _VXXԀTheelongationvalueaccordingtoareferencecitedbyLauetal.,Table13.2,rangedbetween35176percent.#XT"XVS#  Ј(9 Z6Times New Roman RegularTABLE D&X0/&OLE 2.0 Box <=8C HKKKKTABLE ETABLE F _$    10    _VXXԀAtroomtemperatureandat75oC;subjectedtostraincontrolledcycling.#XT"XVT# _$    11    _VXXԀBetween50oCand130oC;timestoruptureexamineduptoseveralthousandhours.#XT"XVT#  _$    12    _VXXԀAt#7V75#V7#w##7Vo#V7###7VC#V7###7VԀwithastrainrateof10#V7#G##7VԄ6#V7###7Vs#V7###7VԄ1#V7#2#.#XT"XVT#http://technology.open.ac.uk/materials/mat-hp.htmlTABLE H _$    13    _VXXԀTensiletestsrangedbetween263Kand398K.#XT"XVT# _$    14    _VXXԀConstantloadcreeptestswerecarriedoutat348K.#XT"XVT#  )  _@WXXAp) %dE %A_Abt_ԀAssociatesInc.0 6 06&6&0 &&0> & &DRAFT: 0> &> &0F&&0F&F&0&&0N&&0N&N&0&&December4,2002#XT"XWJ#TABLE ITABLE GTABLE J % _$    15    _VXXԀReliabilitytestingwascarriedoutfrom20to125oCforupto3,000cycles;andpowercyclingfrom25to110oCfor5,000cycles.#XT"XVT#www.circuitassembly.comTABLE K(http://www.aimsolder.com/leadfree_tdss.cfm?section=assemblyTABLE L  _$    16    _VXXԀm7VԀTheCASTINB.` hp x (#XBalloy(Sn2.5Ag0.8Cu0.5Sb),consistsoftheternaryalloywiththeadditionofagrainrefiningandmelting  temperaturedecreasingdopant.#mXX7mT##XT"XXmXt#  _$    17    _VXXԀTest#7Vboardswerebuiltusingeachthealloyinconjunctionwith1206thinfilmresistors.Thermalshockrangedbetween40to  125oCfor300,400and50015minutecycles#V7#z#.#XT"XVT#  _$    18    _VXXԀTestboardswerebuiltusingeachalloyinconjunctionwith1206thinfilmresistorsandweresubjectedtoflextesting.#XT"XVT#ԈTABLE Mhttp://www.boulder.nist.gov/div853/lead%20free/props01.html : <  ZZ`     шhttp://www.boulder.nist.gov/div853/lead%20free/props01.html+k Times BoldTABLE V  )  _#XX#XnX#+#XXn_Abt_ԀAssociatesInc.0 ` DRAFT: December4,2002#XnXp#http://www.boulder.nist.gov/div853/lead%20free/props01.html<   Z$Symbol Regular(9 Z6Times New Roman Regular C _$    21    _VXXԀTwoprocesseswerecarriedout:waterquenchedandaircooled.Fourrunswerecarriedoutforthewaterquenchedprocessandthe  resultswereaveraged.#XT"XVT#Appendix B: Page - - x _$    26    _VXXԀSeveralliteraturesourcescitedselectcharacteristicsforalloysthatdifferedincompositionfromthatmentioned.Such  compositionshavebeenincludedinparenthesesfollowingtheappropriatecomment.#XT"XVT#  )  _@XXAp) %dE %A_Abt_ԀAssociatesInc.0 6 06&6&0 &&0> & &DRAFT: 0> &> &0F&&0F&F&0&&0N&&0N&N&0&&December4,2002#XnXJ#TABLE R  _$    22    _VXXԀCrossheadspeed:0.1mm/min;gapthickness:76.2PVm#VP#m#XT"XVT# _$    23    _VXXԀCoolingrateinsoldering(test)buttjoints#XT"XVT#http://www.boulder.nist.gov/div853/lead%20free/props01.htmlTABLE Chttp://www.boulder.nist.gov/div853/lead%20free/props01.htmlTABLE Shttp://www.boulder.nist.gov/div853/lead%20free/props01.htmlhttp://www.boulder.nist.gov/div853/lead%20free/props01.htmlAppendix A: Page - - '     x _$    25    _VXXԀSeveralliteraturesourcescitedselectcharacteristicsforalloysthatdifferedincompositionfromthatmentioned.Such  compositionshavebeenincludedinparenthesesfollowingtheappropriatecomment.#XT"XVT#(9 Z6Times New Roman Regular E ZZ`   #mUd# _$    19    _VXXԀ_CTE_:CoefficientofThermalExpansion#XT"XVT# _$    20    _VXXԀ100%_IACS_Ԁ=58.00MS/m#XT"XVT#ԈTABLE NTABLE Q  )  _@XXAp) %dE %A_Abt_ԀAssociatesInc.0 6 06&6&0 &&0> & &DRAFT: 0> &> &0F&&0F&F&0&&0N&&0N&N&0&&December4,2002#XnXJ#Appendix B: Page - -(9 Z6Times New Roman Regularwww.circuitassembly.comhttp://www.boulder.nist.gov/div853/lead%20free/props01.htmlhttp://technology.open.ac.uk/materials/mat-hp.htmlhttp://www.aimsolder.com/lead_free.cfm?section=articles#2 dq$  TRX3' LetterP$'3 Letter Landscape3' Letter'3 Letter LandscapeT  *  _cWXXAp)V "dEV "AAbtAssociatesInc.0  0k F%F%0 k F%k F%  DRAFT :0 F% F%0#F%F%0{#F%#F%0{F%{F%0+F%F%0+F%+F%November27,2002#XT"XWJ#  l  '  _c  ; XX DRAFT #XT"X ;S#Ap)c "dEc "A 8 _$    5    _VXXԀRelativeperformanceinFatigueResistanceofleadfreesoldersinlowcycleisothermalfatiguetest(strain0.2%;0.1Hz;R=0.8;  300K).#XT"XVS# " ZZ`    x _$    3    _VXXԀNote:Oftensourcesdidnotcitevaluesforallalloycompositionsandeachvariableaddressedbythestudy.Thosealloyswithno  performancevaluehavebeenmarkedwithahyphen(!)intheircell.#XT"XVS#   _$    2    _VXXԀ#XT"XVS#VXXT"Note:Karl_Seelig_,#7VAIM,hasprovidedanumberoftechnicalpaperspresentingresultsofleadfreesolderalloys,oftenpresenting h overlappingdata.ItshouldalsobenotedthatTable3inAppendixBcombinesperformancedatafromseveralofthesesources(includingliteraturenotsummarizedinthismemorandum,butlistedunderReferences).#V7###XT"XV# References: Page - -  _$    1    _VXXԀ#XT"XVS#VXXT"Chris_Jorgensen_, LeadFreeElectronicsAssemblies:_Roadmapping_ԀaSmoothTransition,_Circuitree_,September1999.#XT"XV# I *  _WXXAp)K 0ddEK 0AAbtAssociatesInc.0  0v1v10= v1v10 = v1= v10 v1 v10Ev1v10Ev1Ev10v1v1 DRAFT: 0v1v10v1v10Uv1v10!Uv1Uv10$!v1!v10]&$v1$v10(]&v1]&v10 +(v1(v1December4,2002#XT"XWG#        )  _WXXAp)2 dE2 AAbtAssociatesInc. 0 1 0 1B$1B$0 B$ B$09 B$ B$DRAFT: 09B$9B$0AB$B$0AB$AB$0B$B$0IB$B$0IB$IB$December4,2002#XT"XWJ# x _$    24    _VXXԀSeveralliteraturesourcescitedselectcharacteristicsforalloysthatdifferedincompositionfromthatmentioned.Such  compositionshavebeenincludedinparenthesesfollowingtheappropriatecomment.#XT"XVT# !  _y 9NB 9NB      XT"XXX A Q!8Usdd8dv?+ 4 <DL!X? M% XXT"y+E51h p `@ HXE]]Jy T$ T$T$T$memorandum#XT"X  M%#&M%XXT"    ?+ 4 <DL!X?#XT"X%&M# XXT"EnvironmentalResearchArea#XT"X i#&M%XXT"` `    `    T$T$ T$ T$Date   0 4 0 4T$4T$December4,2002  T$ T$  To 0  04T$T$0 4T$4T$KathyHart,U.S.EPA T$ T$  From 0  04T$T$0 4T$4T$_Gaytri_Ԁ_Bhatia_ԀandJocelynSiegel,_Abt_ԀAssociatesInc.< T$ T$    Subject 0  04T$T$0 4T$4T$SummaryofLeadFreeSolderPerformanceBasedonExistingDataProvidedbythe 8 ElectronicsIndustry  T$ T$ Ap) xdAE A |  #XT"X%&M##XT"XXXT"#XT"XXXT"  XXT"Introduction#XT"X #  &M%XXT"Scope   q  Thismemorandum#&M%%&M#&M%%&Msummarizesexistingdataontheperformanceofleadfreesolder#&M%%&M#&M%%&Msavailableintheelectronics v industry.Inparticular,itconsidersliteraturethatreferencedthreespecificalternativesoldertypes:tincopper(SnCu),tinsilvercopper(SnAgCu),andtinsilvercopperbismuth(SnAgCuBi)#&M%%&My #&M%%&M.Additionally,itincludes !P! performancedataforthetinlead(SnPb)alloy#&M%%&M #&M%%&M,asseveralliteraturesourcescompare#&M%%&MW #&M%%&MԀalternativealloydatawith "=" existingtinleadstandards.#&M%%&M #&M%%&MԀThisdocumentisintendedtoprovideEPAsDesignfortheEnvironment(_DfE_)Lead r#*# freeSolderPartnership#&M%%&MP #&M%%&MԀandotherinterestedpartieswithaconsolidatedsourceofkeyleadfreesolder _$$ performancedata.Itidentifiesandsummarizesexistingdataaswellasdocumentsthesesourcesforfurtherresearch.dod #&M%%&M9 #&M%%&MDuringapreliminaryliteraturesearch,leadfreesolderperformancedataavailableintheelectronicsindustry ("( werefoundtobevaried;alloycompositionsaswellasperformancetestscarriedoutonthealternativesoldersdiffered.Asthismemorandumintendstobeinclusiveratherthanoverlookkeyapplicableresults,itincludessummariesofdocumentsthatreferencedalloycompositionsfallingwithinthealloyfamiliesconsidered(forexample,Sn#&M%%&M#Ԅ3Ag4CuandSn0.5Ag4CufallundertheternarySnAgCualloyfamily)&M%%&M.However,itshouldbe +&, notedthatmultiplesourceshaveillustratedthatperformanceresultsvarywhenanalloyscompositionwasaltered.Forexample,#&M%%&M##&%%&MLauetal.citethattheelongationofthetinsilvercoppersystemdropsrapidlywith -Y(. v < ZZ`    increasingbismuthcontentuntilitreachesthe3%level,wheretheelongationdezqcreasesslowlyandlaterlevelsoffwithafurtherincreaseinBicontent.)#&M%%#&#&M%%&MԀAsaresult,performancedataforalloyswerenotlimitedtothe 5 compositionsasdefinedbytheEPAs_DfE_ԀLeadfreeSolderPartnership(refertoTable1),#&M%%&M#&M%%&MԀbutincludedrelevant " dataforalloycompositionsclosetothePartnerships#&M%%&M#&M%%&Mselection#&M%%&Mm#&M%%&M.#XT"X%&M>#&M%XXT"     Table1:EPAs_DfE_ԀLeadfreeSolderPartnershipsSelection:AlloyCompositionsandFamily #&M%%&M##XT"X%&M#XT"XXXT"&M%XXT"   C#XT"X%&M8#&M%XXT"#&M%%&M#&M%%&M #XT"X%&M##XT"XXXT"#t &M%XXT"&M%%&M*kl ddd Xdd Xdd XT$T$,+dd ,odd +  /|  { /#XT"X%&Mc#; XXT"_DfE_ԀLeadfreeSolderPartnershipSelection, '  AlloyComposition A|,!  | AL bcdefghiKy3LAlloyFamily '   Considered :+&    | :#XT"X ; #WXXT"99.3Sn0.7Cu 0$  0P #3ybcdefghiPL bcdefghiKy3LSnCu )$  )95.5Sn4.0Ag0.5Cu -l$  -SnAgCu +l$  +92.3Sn3.4Ag1.0Cu3.3Bi -l  -SnAgCuBi#XT"XW#(l    ( #XT"XXXT"#; XXT";  ;  #XT"X ;/# #XT"XXXT"N#XT"XXXT"#XT"XXXT"#m&M%XXT"&M%%&M 3 Ӏ $    #XT"X%&M^#&M%XXT"Background   #&M%%&M}#&M%%&MTheJapaneseMinistryofInternationalTradeandIndustry(_MITI_)proposedtakebacklegislationinJapan,  requiringconsumerandbusinessuserstoreturnendoflife(EOL)equipmenttoretailersforrecycling,makingthemanufacturerresponsibleforthecostofrecycling.Inresponsetothisandotherproposedlegislation,severalmajorJapaneseelectronicmanufacturersinitiatedtheirown_roadmaps_Ԁandpublicallyannouncedacceleratedplanstocompletelyeliminateleadsolderby2001. GreencompaniesincludedMatsushita,Sony,Toshiba,andHitachi,withotherslikelytofollow.Supplementarytothis,theEuropeanDirectiveonWasteElectricalandElectronicEquipment(_WEEE_Ԁ#&M%%&M` #&M%%&MDirective)#&M%%&M##&M%%&M#XT"X%&M#&M%XXT"ԀproposedaphasingoutofleadbyJanuary1,2004_ `#  1      _,potentially f #&M%%&M$#&M%%&MeliminatingleadfromelectronicdevicesproducedintheEuropeanUnion,aswellasbyforeigncompetition,thus S  drivingtheimplementationofleadfreeassemblyaroundtheworld.#&M%%&M`%#&M%%&M#XT"X%&MW$#&M%XXT" @ Asaresultofinternationallegislativeandmarketpressurestophaseouttheuseoftinleadsolders,#&M%%&Mj&#&M%%&MԀtheuseof  ! leadfreesolderalternativesinelectronicproductsmanufacturedintheU.S.hasalsoreceivedincreasingattention.#&M%%&Mk'# &M%%&MThisworldwideshifttoleadfreeproductsgivesrisetoseveralquestions,keyamongthemisthe !# performanceofalternativesolders.Insearchofasubstitutealloy(s),researchershaveconductednumerousperformancetestsonahostofalternativealloys.  #% #&M%%&MI(#&M%%&MAlargenumberofthealternativesoldersbeingconsideredasareplacementforSnPbarerichintinandcoupledwithadditionalelementstoenhancedifferingalloycharacteristics.Solderperformanceisdeterminedbytestingthealternativesolderforcharacteristicssuchasjointstrength,fatigueresistance,andhightemperaturelife.#&M%%&M)#&M%%&MPreliminaryliteraturesearchesprovidedsomebasicinformationontheelementsconsideredforleadfreesolder o('#* alloys.Forexample,silveriscomparativelyavailableinabundance,however,itishighincost.Bismuthposespotentialproblemswithsupplyaswellasembrittlement(asleadcontaminationdropsitsmeltingtemperaturecausingjointembrittlement).Copperontheotherhand,isreadilyavailableaswellassolubleintin.Additionally,coppercontainingtinalloyshavebeenusedintheindustryinthepast. #,&. d  Z<` <      #&M%%&MS+#&M%%&MP 3ybcdefghiZPL jbcdefghi"x3L #XT"X%&M&# XXT"LiteratureSummary#XT"X S/#&M%XXT"  W P 3xjbcdefghi.P#XT"X%&M/#&M%XXT"Researchofleadfreesolderperformanceistakingplaceonalargescalebymultistakeholderpartnerships, s industrysectors,aswellasacademia.Agoodportionofthesestudiesfocusonperformancetesting,however,apreliminaryreviewfoundthatavastmajorityofthesestudiesareongoingwithperformancedatathatisyettobereleased.Forexample,theHighDensityPackaging(_HDP_)UserGroupInternationalstudiesregardingsolderreliabilitycharacterizationisanongoinglargescalemultistakeholderresearchproject,withresultsestimatedtobecomepublicallyavailablebyyearend2003.Performancestudiesarebeingconductedbyindustry,academiaaswellasnonregulatoryfederalagencies(forexample,theNationalInstituteofScienceandTechnology).Thesestudiesdifferintheirfocus;theyconsideralternativealloys,aswellasperformancetests.Additionally,resultingdataarepresentedinvaryingmetrics.Suchdisparitiesintheuniverseofavailabledata,resultinginvastdifferencesbetweensomeofthesestudies,hindersthecomparisonbetweenperformanceresultsfromthevarioussources.Inordertopresentthesedatainthemostusefulformat,asummaryofeachpaperisprovidedwithinthebodyofthememorandum;whereappropriate,specificdatafromtheindividualstudieshavebeenpresentedinAppendixA.Additionally,severalofthesourcespresentedcomments(asopposedtoquantitativedata)ontheperformanceofthealternativesoldersobservedduringthenumeroustests.SuchqualitativedatahavebeensummarizedinAppendixB.dd#&M%%&MD.#&M%%&MForthepurposeofthesummariespresented,theinformationhasnotbeenquotedorcited.However,itshouldbeassumedthatthelanguagepresentedwithinthesummariesarecitedfromeachrelevantsource.Additionally,itshouldbenotedthatthesedocumentsoftenreferencedmorealloysthanmentionedwithinthesummaries.Inordertoremainwithinthescopeofthisdocument,onlythosealloysthatwereeitherthesameas,orcloseto(i.e.fallwithinthesamefamily),thoseexaminedbythePartnershipsselectionarepresented(refertoTable1).#&M%%&M 7##&%%&M #&M%%#&|9##&%%&M g ##XX%#&R0##&%X#XXyt|  $ #   g   _   TRP$'3 Letter LandscapeX3' Letter'3 Letter Landscape3'Tg H-I- *xd d+dd +odd oklt0t0x,dd ,X dd ,Ldd , dd ,cdd ,dd ,dd , dd +  &   &Table2:ListoftheSummarizedLiterature,SoldersAddressed,andtheFocusofEachStudy##XX%#&+:##&%X#X HBBB|3$pd" H##XX%#&>##T'X#XSection  No. VBB|A2"BBB| VTitle VBB|A2"BB| VAuthors VBB|A2"BB| Vz%Organization VB|A2"BB| VSoldersAddressed HBBB|3$"B| HStudyFocus MBBB}82"BBBB| M 6BBB}!BBB} 6 ?BB}*BBB} ? ?BB}*BB} ? ;B}&BB} ;#W#T'9##T'WSnCu#W#T'B##T'W AB},!& "B} A#W#T'C##T'WSn &  AgCu#W#T'C##T'W AB},! "B} A#W#T'C##T'WSnAg &  CuBi#W#T'vD##T'W EB}0! "B} E EB6 B} / E##XX#T',?##T'X#X#W#T'D##T'W1.#W#T'E# >/!"B >ElectronicsManufacturingWithLeadFree,HalogenFree&ConductiveAdhesiveMaterials >/!] Q >JohnH.Lau,  C.P.Wong,  _ Ning_ ԄChengLee, ] Q _ S.W._ Ԁ_ Ricky_ ԀLee >/!  >byauthor:_ Agilent_ ԀTechnologies,Inc.,Georgia  InstituteofTechnology,NinChengLee,Hong  KongUniversityofScienceandTechnology,respectively >/!  >L bcdefghi y3L b3   b3I2 33  0 @   b3II݌  >/!" > b3   b3{J2 33  0 @   b3{JJ݌  >/!" > b3   b3NK2 33  0 @   b3NKyK݌  BB/!" BЄPhysicalproperties̄Mechanicalproperties̄_ Wettting_ Ԁproperties̄Reliabilityproperties SBD,   / B 3 S#T'W2.#W#T'L# ;,! !"B ;ReliabilityofSolderJointsAssembledwithLeadFreeSolder ;,! # ;#T'W_ Masayuki_ Ԁ_ Ochiai_ ,  $ _ Toshiya_ Ԁ_ Akamatsu_ ,_ Hidefumi_ Ԁ_ Ueda_ #W#T'M# ;,! & ;#T'WFujitsuLaboratoriesLtd.,Japan#W#T'mO# ;,! ' ; ;,! (" ; b3   b3EP2 33  0 @   b3EPpP݌  ;,! )" ; ?B,! *" ?Mechanicalpropertiesattwisting#T'W  + ЄF#W#T'}Q##T'Watiguelifesubjectedtotwisting#W#T'Q##T'WԀ#W#T':R##T'W  , ЄSolderballjointsof_ BGA_ Ԁpackages̄#W#T'}R##T'WSolderjointsof_ QFPs_ #W#T'S# SBD,O C . 3 B V S#T'W3.#W#T'S# ;,!9- /"B ;TheSolder_ Programme_  ;,!9- 0 ;WilliamJ._ Plumridge_  ;,!9- 1 ;TheOpenUniversityMaterialsEngineeringDepartment,UK ;,! 3 ; b3   b3U2 33  0 @   b3UU݌  ;,!9- 4" ; b3   b3V2 33  0 @   b3VV݌  ;,!9- 5" ; ?B,!9- 6" ?#T'WTensileproperties#W#T'W#?+ 4 <DL!X?#T'W 9- 7 ЄFatigueresponse#W#T'0X##T'W  8 ЄCreepbehavior#W#T'X# SBD, 9 V B  S#T'W4.#W#T'YY# ;,! :"B ;?+ 4 <DL!X?MechanicalPropertiesofSn3.0mass%Ag0.5mass%CuAlloy ;,!RF< ;_ Yoshiharu_ Ԁ_ Kariya_ ,William_ Plumbridge_  ;,!RF> ;TheOpenUniversityMaterialsEngineeringDepartment,UK ;,!RF@ ; ;,! A" ; b3   b3[2 33  0 @   b3[%\݌  ;,! B" ;Ѐ ?B,! C" ?#T'WԄTensilebehavior  D ЄCreepbehavior#W#T' ]# SBD,RFE  B 3 S#T'W5.#W#T']# ;,!cWF"B ;PropertiesofLeadFreeAlloyandPerformancePropertiesofLeadFreeNoCleanSolderPaste ;,!I ;_ Quan_ ԀSheng,Sandy_ Kwiatek_  ;,!&K ;_ OMG_ ԀAmericas ;,!cWL ; ;,!cWM" ; b3   b3%`2 33  0 @   b3%`P`݌  ;,!cWN" ; ?B,!cWO" ?#T'WԄMechanicalproperties cWP #W#T'4a##T'WԄCreepperformance &Q ЄWettingproperties#W#T'a##T'WԀ#W#T' b# R #T'W(Nocleansolderpastesystem)#W#T'xb# SBD,S 3 B c S#T'W6.#W#T'+c# ;,!T"B ;LeadFREEAlloys:FittingtheSquarePegintheSquareHole ;,!YMV ;#T'WAngela_ Grusd_ #W#T'!d##T'W, W Chris_ Jorgensen_ #W#T'd# ;,!YMX ;#T'Wbyauthor:_ Heraeus_ Ԁ_ Cermalloy_ , Y #W#T'ce##T'WIPC#W#T'f##T'WԄAssociationConnectingElectronics YMZ Industries#W#T'df#,respectively ;,![ ; b3   b32g2 33  0 @   b32g]g݌  ;,!\" ; b3   b3h2 33  0 @   b3h-h݌  ;,!]" ; ?B,!^" ?#T'WԄPhysicalproperties _ #W#T'i##T'WԄCreep/Fatigue YM` #W#T'}i##T'WԄ_ Wettability_ #W#T'i# SBD,a c B & S#T'W7.#W#T'j# ;,!b"B ;ResearchUpdate:LeadFreeSolderAlternatives ;,!d ;_ Jasbir_ ԀBath,Carol_ Handwerker_ ,EdwinBradley ;,!sg ;NationalElectronicsManufacturingInitiative(_ NEMI_ ) ;,!i ; b3   b3l2 33  0 @   b3ll݌  ;,!j" ; b3   b3m2 33  0 @   b3mm݌  ;,!k" ; ?B,!l" ?#T'WԄPhysicalproperties m ЄReliabilitȳ_ Reflow_ Ԁandwavesoldering#W#T'n##T'WԄ#W#T'\o##T'WMechanicalproperties#W#T'o# SBD,B6p & B  S#T'W8.#W#T'Jp# ;,!q"B ;#T'WAIM:TechnicalDataSheet#W#T'p# ;,!r ;AIM ;,!s ;#T'WoAIM#W#T'q# ;,!t ; b3   b33r2 33  0 @   b33r^r݌  ;,!u" ; b3   b3s2 33  0 @   b3s.s݌  ;,!v" ; ?B,!w" ?#T'WԄMechanicalproperties#W#T't##T'W x ЄW#W#T'kt##T'Wettingproperties y ЄF#W#T't##T'Watigueresistance z ЄSolderjointreliabilitȳWaveSolderingandSMTapplications#W#T'0u# SBD,+|  B @ S9. ;,!}"B ;MaterialsandProcessConsiderationsforLeadFreeElectronicsAssembly ;,!  ;Karl_ Seelig_ ԀandDavid_ Suraski_  ;,! ;AIM ;,! ; b3   b3w2 33  0 @   b3ww݌  ;,!" ; b3   b3x2 33  0 @   b3xx݌  ;,!" ; ?B,!" ?X#T'WԄPhysicalproperties  ЄMechanicalproperties̄WettingpropertiesGքReliabilitytesting#W#T'y# UBBD,Q!E @ B  $U#T'W10.#W#T'z# =B,!H"<"BB =DatabaseforSolderPropertieswithEmphasisonNewLeadfreeSolders =B,!# B =_ NIST_ Ԁand_ CSM_  =B,!H"<B =NationalInstituteofStandards&Technology(_ NIST_ )andColoradoSchoolofMines(_ CSM_ ) =B,! #B = b3   b3/}2 33  0 @   b3/}Z}݌  =B,!H"<"B = b3   b3~2 33  0 @   b3~,~݌  =B,!H"<"B = b3   b3~2 33  0 @   b3~~݌  ?BB,!H"<"B ?@#T'WԄPhysicalproperties H"< ЄMechanicalproperties̄Thermalproperties#W#T'##XT"XWE#@64#  $  BB @h,@|#XXXXT" !  TRX3' LetterP$'3 Letter Landscape3' Letter'3 Letter LandscapeT 9NBy  t   9NB#&%X#X  1.ElectronicsManufacturingWithLeadFree,HalogenFree&ConductiveAdhesiveMaterials #&M%%#&ڀ##&%%&M  9%  <DL!X9' S X  X'#&M%%#&##&%%&M%(   X S X(-X X  X-Author(s): >  JohnH.Lau#&M%%#&]##&%%&M,C.P.Wong#&M%%#&>##&%%&M,_ Ning_ ԄChengLee#&M%%#&##&%%&M,_ S.W._ Ԁ_ Ricky_ ԀLee#&M%%#& ##&%%&M  #&M%%#&##&%%&M0   Organization: > #&M%%#&##&%%&M0 T$T$byauthor:_ Agilent_ ԀTechnologies,Inc.,#&M%%#&l#GeorgiaInstituteofTechnology,NinCheng  Lee,#&%%&MHongKongUniversityofScienceandTechnology,respectively~ T$ T$ Publication/Source:0 _ McGraw_ ԄHill#&M%%#&S#m&%%&M,#&M%%m&;##&%%&MCh.13:PrevailingLeadFreeAlloys,p.13.113.62k T$ T$ #&M%%#&##&%%&MDate:0  0>T$T$0 >T$>T$September2000#&M%%#&##&%%&MX { T$ T$ _ DfE_ ԀAlloysConsidered:0 #&M%%#&##&%%&M##XX%#&##&%X#XSnCu,SnAgCu,SnAgCuBiE h T$ T$ #&M%%#&?##&%%&M#&M%%#&##&%%&MSummary:0 > 0 >T$>T$Thisisacomprehensivehandbook,coveringintegratedcircuit(IC)packaging,  B  printedcircuitboard(PCB)/substrates,assemblyofICpackages,andnovelconductiveadhesivematerials.Emphasisisonfundamentalprinciples,engineeringdata,andmanufacturingtechnologies.Amongothers,thissourceconsiderstheSnCu,SnAgCuandSnAgCuBialloys.  T$ T$ #&M%%#&A##&%%&M Physicalproperties #&M%%#&<##&%%&M:EutecticSnCuhasthehighestmeltingtemperatureamongprevailingleadfreesolders,  suggestinggreaterdifficultyinadoptingthisalloy.Theternaryeutecticcomposition(approximately95.6Sn3.5Ag0.9Cu)hasameltingpointof217#&M%%#&##&%J&Mo#&M%%#&##&%%&MC,whilethemeltingtemperatureforSnAgCuBirangesbetween207  216#&M%%#&-##&%J&Mo#&M%%#&ΐ##&%%&MC.SnCuiscomparableinsurfacetension,electricalresistivity,anddensitywithSnAg,SnAgCuandSn v AgCuXduetothedominantpresenceoftin.Thehardnesshowever,doesvary;thatoftheternaryalloyis c comparablewithSnPb.BismuthcontainingalloysontheotherhandexhibitconsiderablyhigherhardnessthanSnPbduetotheprecipitationandBidissolutionstrengtheningmechanisms.(RefertoAppendixA,Table1.a)#&M%%#&##&%%&M Mechanicalproperties: #&M%%#&9##&%%&MԀEutecticSnCuislowerintensilestrengthbuthigherinelongationthanbotheutectic 8 SnAgandSnPb,reflectingitssoftnessandductility.ThetensilestrengthofSnAgCuishigherthaneutecticSnPb.Neartheternaryeutecticpoint,SnAgCualloysarehigherthanSnPbinyieldstrength,shearstrength,impactstrength,andcreepresistance.ForSnAgCualloysfurtherawayfromternaryeutecticcomposition,themeltingtemperature(214to244#&M%%#&##&%J&Mo#&M%%#&ƕ##&%%&MC)increases,aswellasthetensileandshearstrengths,attheexpenseof  reductioninelongation.#&M%%#& ##&%%&MSnAgCuBialloysexhibitahighertensilestrengthandyieldstrength,alower  elongationandaslowercreeprateascomparedtoeutecticSnPb.ShearstrengthofSnCuiscomparablewithSnPb.ThecreepstrengthofSnCuishigherthan100Sn,butlowerthanSnAgCuatboth20and100#&M%%#&ǖ##&%J&Mo#&M%%#&B##&%%&MC.At25  and100#&M%%#&##&%J&Mo#&M%%#&##&%%&MC,thetimetoruptureincreasesinthefollowingorder:eutecticSnAg,SnAgCuSnAgCu>SnAg>SnCuwhenan_ unactivated_ Ԁfluxisused.Thedifferenceinwettingdiminisheswhenanactivatedfluxisusedandwhenthewettingtimeisplottedagainstsuperheating.At260#&M%%#&՝##&%J&Mo#&M%%#& ##&%%&MC#&M%%#&P##&%%&M,thewetting )&* timedescendsinthefollowingorder:96Sn2.5Ag1Bi0.5Cu>96.2Sn2.5Ag0.5Sb0.8Cu>63Sn37Pb>99.3Sn0.7Cu>96.5Sn3.5Ag>95.5Sn4Ag0.5Cu.Wettingtimestudiesconductedbythe_ meniscograph_ methodpresentedincreasingwettingtimesforsoldersinthefollowingorder:63Sn37PbSnAgCu4.5Bi,SnAgCu7.5Bi#&M%%#&##&%%&M  >Sn3.5Ag0.75Cu>99.25Sn0.75Cu#&M%%#&Ť##&%%&M.ThissourcestatesthatpreferablytheuseofeutecticSnCushouldbe  confinedtowavesoldering.VaryingreferencesrangedwettingtimesfortheSnAgCualloyfrom0.23to1.1seconds,whilespreadingbehaviorrangedbetween3.9to5#&M%%#&>##&%%&Mandcontactanglerangedbetween21to47degrees#&M%%#&##&%%&M. ~ ThepresenceofBisignificantlyimprovesthesolderspreadingpropertiesofleadfreesolders.TheSnAgCuBisystemisoutstandingincreepresistanceandwetting.(RefertoAppendixA,#&M%%#&##&%%&M##XX%#&##&%X#XTable1.d) X { #&M%%#&##&%%&M Reliability:#&M%%#&##&%%&MԀ ThetensilestrengthoftheeutecticSnCuisfairlypoor,howeveritsfatigueresistanceisfairlygood. 0 S  Onestudyshowedfatigueresistancetoincreaseinthefollowingorder:63Sn97Pb<64Sn36In<58Bi42Sn<50Sn50In<99.25Sn0.75Cu<100Sn<96Sn4Cu.However,thelowcycleisothermalfatigue(strain0.2%,0.1Hz,R=0.8,300K)performanceshowsthatthenumberofcyclestofailureforeutecticSnCuislessthanone    thirdofthatforeutecticSnPb,whileternary95.4Sn3.1Ag1.5Cuissignificantlygreater.ForthetwocasesinthisstudywhichcomparedSnCuwithSnPb,SnCuisconsistentlybetter.Fora12mm,144flexibleballgridarray(_ fleXBGA_ )assemblyatdifferentcyclingtemperatures,SnAgwasthebest,withlowornofailurerates.TheternarySn4Ag0.5CuandSn3.4Ag0.7CuaresimilartoeachotherandalsohavebetterperformancethaneutecticSnPb.At40to125oCcycling,however,SnCuperformssimilarlytoSnPbandlittleimprovementis  shownforSnAgCuoverSnPb.Inthisrange,eutecticSnAgisagainthebestperformer.Fortemperaturecyclingperformanceinballgridarray(_ BGA_ )assembly,eutecticSnAgappearstobesuperiortoSnCu,buttheoppositeisobservedforflipchipassembly.Itwasreportedthatthethermalfatiguelifeforflipchipassemblydescendsinthefollowingorder:eutecticSnCu>Sn3.8Ag0.7Cu,eutecticSnPb>eutecticSnAg.ThepresenceofBiintheleadfreealloyscanforma52Bi30Pb18Snternaryeutecticstructureinthesolidifiedsolderjointwhichhasameltingtemperatureof96oC#&M%%#&##&%%&M.Thiscanbeaconcernbecausethesolderjointsbecome 8 weakwhensubjectedtothermalcycling.#&M%%#&##&%%&MԀLauetal.,presentadditionaldataontemperaturecyclingandheat % treatmentreliabilityforSnAgCuaswellasSnAgCuBi.Inallthereportedresults,theSnAgCusystemistheprevailingalternativetoleadcontainingsolder.#&M%%#&ְ#  #&%%&M (RefertoAppendixA,Tables1.ato1.d)    :0]-1 H- H H  2.ReliabilityofSolderJointsAssembledwithLeadFreeSolder #&M%%#&*##&%%&M  9K> FXX X9Author(s): >  _ Masayuki_ Ԁ_ Ochiai_ ,_ Toshiya_ Ԁ_ Akamatsu_ ,_ Hidefumi_ Ԁ_ Ueda_   #&M%%#&h##&%%&MOrganization: >  FujitsuLaboratoriesLtd.,_ Atsugi_ ,Japan  Publication/Source:0 FujitsuScienceTechnologyJournal, 38 ,1,p.96101~ T$ T$ Date:0  0>T$T$0 >T$>T$June2002o T$ T$ _ DfE_ ԀAlloysConsidered:#&M%%#&!##&%%&M##XX%#&V##&%X#X0 SnPb,SnAgCu\  T$ T$ Summary:#&M%%#&##&%%&MԀ0 > 0 >O$>O$ThedynamicmechanicalpropertiesandreliabilityofSnAgCuweretestedinthis 6 Y  study.ComparedtotheeutecticSnPbsolder,#&M%%#&̷##&%%&Mtheternaryalloywasfoundharderto # F  deformandmoreresistanttohardening,thushavingalongerfatiguelife.#&M%%#&ø#Ԁ#&%%&M 3  O$ O$  Dynamicmechanicalpropertiesattwisting,#&M%%#&##&%%&Mtemperaturedependence#&M%%#&%##&%%&M: Theshearmodulus(similartoYoungs   modulusfortension,butindicatestheratioofashearstresstoitsresultingshearstrain)ofbothSnPbandSnAgCudecreasedwithrisingtemperature.Thetinleadalloy,however,hadamuchlargerrateofdecreasethentheternaryalloy,showingthattheformersoftensfasterthanthelatterwithincreasingtemperatures.ItwasalsofoundthattheSnAgCusolderismoredifficulttodeformthantheSnPbsolder,islesslikelytoharden,andthereforehasalongerfatiguelife.#&M%%#&#    #&%%&M Influenceoftwistingvelocityondynamicmechanicalproperties#&M%%#&##&%%&M: Thetinleadsolderwasfoundtodeform g easilyattwistingvelocitiesbelow1rad/s(i.e.,therangeoftwistingvelocitiesthatsolderjointsaresubjectedtoinnormalequipmentoperation).Theternaryalloywasshowntobedifficulttodeformplasticallyandthuslesslikelytoharden.  #&M%%#&##&%%&M Fatiguelifeofsolderssubjectedtotwistingcycles#&M%%#&4##&%%&M: ThefatiguelifeofSnAgCusolderwasapproximately  - 10,000cycles,almosttwicethefatiguelifeoftheSnPbsolder.Theseresultsagainindicatethatcomparedtothetinleadsolder,SnAgCuishardertodeformplasticallyandthereforelesslikelytoharden.Thissuggeststhattheternaryalloyhassufficientfatigueresistanceforuseinelectronicsassembly.#&M%%#&##&%%&M    #&M%%#&##&%%&M Solderballjointsof_ BGA_ Ԁ(BallGridArray)packagesduringtransitiontoleadfreesoldering:#&M%%#&##&%%&M#&M%%#&##&%%&M Whilein  transition,leadandleadfreesolderswillbeusedcombinedin_ BGA_ Ԁballjoints.MixingSnAgCusolderwithSnPbwasfoundtoreducethefatiguelifeslightly,maintainingitssuperioritytothatoftheSnPbsolder.Thissuggestssufficientreliabilityforthemixedsolderjoint.  #&M%%#&##&%%&M Solderjointsof_ QFPs_ Ԁ(QuadFlatPack)aftertransitiontoleadfreesoldering: Afterthetransition,_ QFP_ Ԁleads T#w # willbeplatedwithleadfreesolder,contaminatingthejointswithleadfreesolderplating.AplatingcompositionofSn2Bipresentedan#&M%%#&##&%%&Mapproximate30%reductioninfatiguelifeintheSnAgCusolder.However,thefatigue 0%S"% lifewasstillsuperiortothatoftheSnPbsolder.ItwasconcludedthatSnAgCusolderjointswithanexpectedlevelofbismuthcontaminationwillhaveafatiguelifecomparabletocurrentSnPbsolderjoints.#&M%%#&D#  '-$'   #&%%&M(RefertoAppendixA,#&M%%#&##&%%&M##XX%#&8##&%X#XTable2) (&) #&M%%#&A##&%%&M  _/,0 Ї3.TheSolder_ Programme_ ԀattheOpenUniversityMaterialsEngineeringDepartment:AnUpdate,2001#&M%%#&##&%%&M   #&M%%#&##&%%&MAuthor(s): >  WilliamJ._ Plumbridge_   #&M%%#&)##&%%&MOrganization: > 0 MaterialsEngineeringDepartment,TheOpenUniversity,_ Buckinghamshire_ ,U.K. O$ O$ #&M%%#&##&%%&MPublication/Source:0 MaterialsEngineeringDepartment,#&M%%#&##&%%&MTheOpenUniversity,UK. ~ 4ɮ \O  5  (#&M%%#&P##&%%&Mhttp://technology.open.ac.uk/materials/mathp.html6\O  7ɰ)#&M%%#&3##&%%&Mk O$ O$ Date:0  0>O$O$0 >O$>O$2001#&M%%#&##&%%&MX { O$ O$ _ DfE_ ԀAlloysConsidered:0 #&M%%#&##&%%&M##XX%#&##&%X#XSnPb,SnCu,SnAgCuE h O$ O$ #&M%%#&F##&%%&MSummary:0 > 0 >O$>O$#&M%%#&##&%%&MTheOpenUniversityprogramhasbeendirectedtowardsthetestingperformanceof  B  solderjoints.#&M%%#&n##&%%&M##XX%#&##&%X#XThissourcebrieflyreviewsthebackgroundandcurrentstatusofthe  /  researchintosolderalloysandsolderinterconnectionsforuseinelectronics.Itpresentsindepthresultsforfatigue,creepandfatiguecreepinteractionsathightemperatures.ItconsiderstheSn0.5CuandternarySn3.8Ag0.7Cualloys.  O$ O$  TensileProperties: #&M%%#&'##&%%&MԀThebehaviorofthereferencedalloyswastestedattemperaturesbetween10and75#&M%%#&*##&%J&Mo#&M%%#&##&%%&MCand  strainratesbetween10#&M%%#& ##&%J&MԄ1#&M%%#&##&%%&MԀand10#&M%%#&##&%J&MԄ6#&M%%#&##&%%&Ms#&M%%#&\##&%J&MԄ1#&M%%#&##&%%&M.Temperatureandstrainratewerefoundtohaveasubstantialeffecton  strength.Raisingthetemperaturefrom10#&M%%#&##&%%&MԀto75#&M%%#&##&%J&Mo#&M%%#&##&%%&MCwasfoundtoreducethetensilestrengthbyapproximately  75%ofitsvalueat10#&M%%#&I##&%J&Mo#&M%%#&##&%%&MC(forexample,theSnPbandSnCualloysfellbelow10MPaat75#&M%%#&;##&%J&Mo#&M%%#&##&%%&MC#&M%%#&##&%%&MԀwithastrainrate v of10#&M%%#&J##&%J&MԄ6#&M%%#&##&%%&Ms#&M%%#&##&%J&MԄ1#&M%%#&I##&%%&M).#&M%%#&##&%%&MԀDuctilitytrendswithtemperatureandstrainratewereseentobesmallandinconsistent.TheSnAg c CuandSnAgalloysdisplaythesmallestelongationtofailurealthoughtheductilityvaluesofallthealloysfalltobetween20and55%.TheSn0.5Cusolderisusuallytheweakestandmostductileofthetestedalloys,whereascomparatively,theSnAgCualloyisthestrongest(withstrengthbeinggreatestat10#&M%%#&##&%J&Mo#&M%%#&##&%%&MCwiththefastest *M strainingrates).Thispaperfindsthatthe interrelationshipsbetweenstrength,ductility,temperatureandstrainratearecomplex,andtherelativemeritsofthealloysmaychangeaccordingtothetestconditions.#&M%%#&##&%%&M FatigueResponse:#&M%%#&b##&%%&MԀ Fatiguetestswerecarriedoutatroomtemperatureandat75#&M%%#&##&%J&Mo#&M%%#&A##&%%&MConSn37Pb,Sn0.5Cu,and  Sn3.5Ag,exhibitingsoftening(around1520%)whensubjectedtostraincontrolledcycling.Theincorporationofadwellinthestraincyclereducesthenumberofcyclestofailureincomparisonwithcontinuouscycling,irrespectiveofthedwelllocation.Forthemostpart,longerdwellsresultinlowernumbersofcyclestofailure,withbalanceddwellsresultingintheshortestlifetimes.#&M%%#&##&%%&M   CreepBehavior:#&M%%#&##&%%&MԀ Creeptestingwascarriedoutbetween50#&M%%#&##&%J&Mo#&M%%#&e##&%%&MCand130#&M%%#&##&%J&Mo#&M%%#&##&%%&MCandtimestorupturewereexaminedup n!! toseveralthousandhours.ThecreepbehavioroftheSn0.5CualloyissimilartothatofSn37Pbat75#&M%%#&?##&%J&Mo#&M%%#&'##&%%&MC,while ]"" SnAgCuexhibitsmuchgreatercreepresistancethatappearstoincreaseatlowerstresslevels.BoththesilvercontainingalloysexhibitamuchgreatercreepresistancethanSn37Pb,appearingtoincreaseatlowerstresslevels.Thissuperiorcreepperformanceisintrinsictothealloy,asgreaterlifeisretainedwhentestingatthesamehomologoustemperaturestononsilveralloys.Athightemperatures(forexample,99#&M%%#&m##&%J&Mo#&M%%#&z##&%%&MC),therupturetime &4#& ofthesilvercontainingalloysareextremelysensitivetostress,whereminorchangesinserviceconditionscouldresultinprofoundconsequencesoncreeplife.#&M%%#&##&%%&MLeadfreealloysshowlowercreepductilityascomparedwiththe '%( eutecticSn37Pb(approximately40%)at75#&M%%#&##&%J&Mo#&M%%#&##&%%&MC#&M%%#&##&%%&M.Thecreepductilityofthesilvercontainingalloysisthelowestat (%) around20%,andappearstobeunaffectedbyappliedstress.Potentially,themostpopularleadfreealloyisthepatentedSn3.8Ag0.7Cu.#&M%%#&#  #&%%&M TinPest: #&M%%#&T##&%%&MԀTinpestcanbefoundintheSn0.5Cualloywhenstoredforoverayearattemperaturesbelow13#&M%%#&##&%J&Mo#&M%%#&R##&%%&MC. ,)- Herewhitetintransformstogreytinwithasubstantialincreaseinvolume,resultingprimarilyinsurfacewartformationandcracking,andfinallyincompletedisintegration.(RefertoAppendixA,Table3) B0e-1 Ї#&M%%#&#  #&%%&M >N>N4.MechanicalPropertiesofSn3.0mass%Ag0.5%mass%CuAlloy#&M%%#&##&%%&M   #&M%%#&z##&%%&MAuthor(s): >  _ Yoshiharu_ Ԁ_ Kariya_ ԀandWilliamJ._ Plumbridge_   #&M%%#&##&%%&MOrganization: > 0 MaterialsEngineeringDepartment,TheOpenUniversity,_ Buckinghamshire_ ,U.K. O$ O$ #&M%%#&##&%%&MPublication/Source:0 MaterialsEngineeringDepartment,TheOpenUniversity,U.K.#&M%%#&##&%%&M~ O$ O$ Date:0  0>O$O$0 >O$>O$NotProvided#&M%%#&i##&%%&Mk O$ O$ _ DfE_ ԀAlloysConsidered:#&M%%#&##XT"X%&Mi#&M%XXT"#&%%&M0 SnAgCuX { O$ O$ #&M%%#&##&%%&MSummary:#&M%%#&^##&%%&M0 > 0 >O$>O$ThispaperinvestigatesthetensileandcreepbehaviorofSn3.0Ag0.5Cuinthe 2 U  rapidlycooled,ascaststate,andcomparesitwithSn3.8Ag0.7CuandSn3.5Ag.Temperatureforthetensiletestsrangedbetween263Kand398K,andtheconstantloadcreeptestswereperformedat348K.  O$ O$ Theternaryalloys,Sn3.0Ag0.5CuandSn3.8Ag0.7Cu,werefoundtohavesimilartensilestrengths,wheretensilestrengthwasfoundtodecreasewithincreasingtemperatureandwithdecreasingstrainrate.Thetensilestrengthfortheformeralloywas20%higherthanSn3.5AganddoublethatobservedinSn0.5Cuatastrainrateof10#&M%%#&##&%J&MԄ3#&M%%#&##&%%&M/sand348K.BothSn3.0Ag0.5CuandSn3.8Ag0.7CuwereshowntobesuperiortotheSn3.5Agalloy  inthischaracteristic.#&M%%#&##&%%&MThecreepresistanceofboththeternaryalloyswerefoundcomparabletoeachotherandclearlysuperiortothe a SnAgalloy.Appliedstresshadlittleeffectonthecreepductilityofthealloys,withthecreepductilityofSn3.0Ag0.5CubeingalmostequivalenttoeutecticSnAgandthestandardSnAgCuforthisproperty.#&M%%#&#H ?N?N(RefertoAppendixA,Table4)A/3#&%%&M#&M%%#&# #&%%&M    5.PropertiesofLeadFreeAlloyandPerformancePropertiesofLeadFreeNoCleanSolderPaste #&M%%#&##&%%&M  #&M%%#&##&%%&MAuthor(s): >  _ Quan_ ԀSheng,CharlesBradshaw,Sandy_ Kwiatek_   Organization: >  _ OMG_ ԀAmericas,ResearchTrianglePark,NC  Publication/Source:0 PresentedatIPC_ SMEMA_ ԀCouncilAPEX#&M%J#&3##&%J&M#&M%%#&##&%%&M2002(www.goapex.org)~ O$ O$   Date:0  0>O$O$0 >O$>O$2002#&M%%#&K##&%%&Mk O$ O$ _ DfE_ ԀAlloysConsidered:#&M%%#& ##&%%&M##XX%#&##&%X#X0 SnPb#&M%%#&##&%%&M,SnAgCuX { O$ O$ Summary:#&M%%#&7##&%%&M0 > 0 >O$>O$This#&M%%#&##&%%&MԀpaperexaminesthedevelopmentofanocleansolderpastesystemwiththe 2 U  uniqueneedsofthe214220#&M%%#&##&%J&Mo#&M%%#&##&%%&MC#&M%%#&##&%%&MԀ#&M%%#&a##&%%&Mmeltingpointofleadfreealloys.Thepropertiesof  B  theSn3.5Ag0.5Cunocleansolderpastearecomparedto63Sn37Pbnocleansolderpaste.  O$ O$ Mechanicalpropertiesofthetwoalloyscomparedfavorablyshowing#&M%%#&##&%%&Mslightlylowerultimatetensilestrengthand   yieldstrengthfortheleadfreealloy.Resultswereinconsistentforelongationforthetwoalloys.Creepperformanceoftheternaryalloyinbulkwasfoundtobesuperiortothe63SnPballoy.Wettingpropertiesofsolderjointsmadewithbothpasteswerefoundtobecomparable.Bothalloysdemonstratedsimilarstaticviscosity,dynamicviscosity,tack,printability,solderability,wide_ reflow_ Ԁwindow,and_ reflow_ Ԁcharacteristics.Finally,theleadfreenocleanpastewasfoundtopotentiallyhavealongerprintlifethan63SnPb.#&M%%#&#Froma t performancestandpoint,leadfreenocleanSn3.5Ag0.5Cupastehassimilarcharacteristicsto63SnPb,andcouldbeusedforPCBapplications.@N@N(RefertoAppendixA,Table5)  #&%%&M #&M%%#&##&%%&M    6.LeadFREEAlloys:FittingtheSquarePegintheSquareHole#&M%%#&##&%%&MԀ   #&M%%#&##&%%&MAuthor(s): >  Angela_ Grusd_ #&M%%#&##&%%&MԀandChris_ Jorgensen_ #&M%%#&#  Organization: >  #&%%&M_ Heraeus_ Ԁ_ Cermalloy_ Ԁand#&M%%#&G##&%%&MIPC#&M%%#&##&%%&MԄAssociationConnectingElectronicsIndustries#&M%%#&% ##&%%&M  Publication/Source:0 _ Circuitree_ ,p.98102~ O$ O$ _ DfE_ ԀAlloysConsidered:0 #&M%%#& ##&%%&M##XX%#&##&%X#XSeptember1999k O$ O$ _ DfE_ ԀAlloysConsidered:##XX%#& ##&%X#X#&M%%#& ##&%%&M SnCu,SnAgCu X {   Summary:#&M%%#& ##&%%&M0 > 0 >O$>O$Thispaperprovidesanoverviewofnumerousleadfreealloys,examining 2 U  temperatureratings,cost,andotherfactors.Twoofthealloyspresentedinthispaper,arethesameasthosebeingexaminedinthe_ DfE_ ԀLeadfreeSolderPartnership.Thesesolders,99.3Sn0.7Cuand95.5Sn4.0Ag0.5Cu,havemidrangemeltingtemperatures(i.e.between200#&M%%#&U ##&%J&Mo#&M%%#&F##&%%&MC230#&M%%#&##&%J&Mo#&M%%#&##&%%&MC),slightlyhigherthanthatoftinlead,and   havebeenpopularchoicesintheindustry,particularlyinthecaseof_ reflow_ soldering.#&M%%#&#  O$ O$   #&%%&M TinCopper#&M%%#&E##&%%&M: Themeltingtemperatureforthisalloy(99.3Sn0.7Cu)is227#&M%%#&##&%J&Mo#&M%%#&"##&%%&MC.Thisalloymayprovesuitablefor  hightemperatureapplicationssuchasthoserequiredbytheautomotiveindustry.Testingshowssignificantimprovementincreep/fatiguedataoverSnPballoy.However,theSnAgXalloysarefoundtoperformbetterin x creeptesting.#&M%%#&h##&%%&M e    TinSilverCopper#&M%%#&##&%%&M: Themeltingtemperatureforthisalloy(95.5Sn4.0Ag0.5Cu)fallsbetween217219#&M%%#&a##&%J&Mo#&M%%#&##&%%&MC.This ?b temperaturerangemakesitwellsuitedforhighoperationtemperatures(upto175#&M%%#&E##&%J&Mo#&M%%#&##&%%&MC).#&M%%#&=##&%%&MԀThemechanicalstability .Q ofthejointisdegradedwhenthemeltingpointofthesolderisapproached.Thus,elevatedtemperaturecyclingproduceslessdamagewithhighermeltingpointsolders#&M%%#&##&%%&MthanitdoesforSnPbsolders(meltingpointof183#&M%%#&##&%J&Mo#&M%%#&##&%%&MC).#&M%%#&X##&%%&M + Thesesoldershowever,donotwetcopperaswellastheeutecticSnPbsolderusingcommercialfluxes.However,ifthefluxesaresuitedforhightemperatureuse,goodfilletformationcanbeachieved._ Wettability_ Ԁcanalsobeimprovedusingnocleanfluxeswhensolderinginnitrogenatmosphere.Thispaperpointsoutthatthereareotherfactorsbesidesperformance,suchascost,toconsiderwhenselectingaleadfreealloy.#&M%%#&#ANAN(RefertoAppendixA,Table6)#&%%&M##XX%#& ##&%X#X   @0c-1 A  `H `    BNBN#&M%%#&#  #&%%&M7.ResearchUpdate:LeadFreeSolderAlternatives#&M%%#&(##&%%&M   #&M%%#&##&%%&MAuthor(s): >  _ Jasbir_ ԀBath,Carol_ Handwerker_ ,EdwinBradley  Organization: >  NationalElectronicsManufacturingInitiative(_ NEMI_ )    Publication/Source:0 CircuitsAssembly4nG0\O  5  (#&M%%#&##&%%&Mwww.circuitassembly.com6\Omak  7ll),p.3140.~ O$ O$ Date:0  0>O$O$0 >O$>O$May2000#&M%%#&##&%%&Mk O$ O$ _ DfE_ ԀAlloysConsidered:0 SnCu,SnAgCuX { O$ O$ #&M%%#&@#  #&%%&MSummary:0 > 0 >O$>O$ThispaperidentifiesSn3.9Ag0.6Cuastherecommendedchoicefor_ reflow_  2 U  soldering,andSn0.7CuorSn3.5Agastherecommendedchoicesforwavesoldering.Itprovidesanupdateoncurrentresearchforleadfreesolderalternatives,andmakesnotethatfurtherinvestigationsarebeingconductedonthealternativealloys.  O$ O$ #&M%%#& ##&%%&M TinCopper: TheeutecticalloySn0.7Cuhasameltingtemperatureof227o#&M%%#&"##&%%&MC.Reliabilitydataindicatesitis   similartoSn37Pbforsurfacemountuse.Duetoa#&M%%#&"##&%%&Mmeltingtemperature10o#&M%%#&d###&%%&MC#&M%%#&###&%%&MԀhigher#&M%%#&$##&%%&Mthantheternary#&M%%#&P$##&%%&MSnAgCu  alloy,Sn0.7Cuisfoundundesirablefor_ reflow_ Ԁapplications.Thistemperaturedoesnotpresentthesameconcernforwavesolderingapplications.Thispapermakesnoteofatendencyforfilletliftingwhenusingtinsilver,tincopperortinsilvercopperalloysforwavesolderingwithleadcontainingsurfacefinishes,duetothepresenceoflead.AsignificantadvantagetousingSn0.7Cuisthelowcostofbarsolder. TinSilverCopper#&M%%#&$##&%%&M: Alloyswithinthisfamilywithameltingrangebetween217oC#&M%%#&&##&%%&Mand222oCaregoodsubstitutes =` fortinleadsolder.T#&M%%#&p'##&%%&MheEuropeanIDEALSconsortium#&M%%#&(##&%%&MrecommendedtheSn3.8Ag0.7Cualloyasthebestlead ,O freealloyfor_ reflow_ .#&M%%#&a(##&%%&MԀReliabilityforthisalloycompositionwasfoundequivalenttoorbetterthantheSnPband < SnPbAgalloys.#&M%%#&%)##&%%&M ) #&M%%#&)##&%%&MWithinthisternaryalloyfamily,severalreadilyavailablealloysSn3.5Ag0.7Cu,Sn3.6Ag0.9Cu#&M%%#&?*##&%%&M,Sn3.8Ag  0.7Cu,aswellasSn4Ag0.5Cu#&M%%#&*##&%%&Mhavemeltingtemperaturesnear217o#&M%%#&f+##&%%&MC.Alloycompositionswithintherangeof  Sn3.5to4%(weight)Ag0.5to1%(weight)Cu#&M%%#&+##&%%&Marecloseenoughtotheeutectictohavesimilarliquidus  temperatures,microstructuresandmechanicalproperties.#&M%%#&,##&%%&MBathetal.notethatresultsfromliteratureandsolder  vendorsindicatethatthesolderabilityoftheternaryalloyisadequate,howeverlikeallleadfreealloys,worsethaneutecticSnPb.#&M%%#&J-##&%%&M    #&M%%#&a.##&%%&MThe_ NEMI_ ԀLeadFreeTaskForcedecidedontheSn3.9Ag0.6Cusolderastheirrecommendationtotheindustry ["~" for_ reflow_ Ԁsoldering.ForwavesolderingtherecommendedchoicesareSn0.7CuandSn3.5Ag.The_ NEMI_ ԀLeadFreeTaskForceiscontinuingtoinvestigatetheperformanceofthesesubstitutes.Updatedinformationcanbefoundonthe_ NEMI_ Ԁwebpage:4N \O  5  60\O0  7N 14XN \O  5  #&M%%#&.##&%%&M6p1\O1  7XN 1Ԁ(4ha \O  5  http://www.nemi.org/newsroom/Presentations/index.html#&M%%#&1#6Y2\Om2resu  7haJ2) "%E"%  CNCN(RefertoAppendixA,Table7)#&%%&M##XX%#&-##&%X#X  &$'  >0a-1   ` ZZ`     DNDN#&M%%#&3##&%%&M8.AIM:TechnicalDataSheet #&M%%#&4##&%%&M  #&M%%#&A5##&%%&M<X FXK> FX<0   0O$O$  Organization: > 0 O$O$AIM O$ O$ Publication/Source:0 AIM:TechnicalArticles:LeadfreeProductDataSheets  4 \O  5  (67#&M%%#&5##&%%&Mhttp://www.aimsolder.com/leadfree_tdss.cfm?section=assembly#&M%%#&~7#66\O6Xg  7#^)7)~ O$ O$ Dated:0  0>O$O$0 >O$>O$NotProvidedk O$ O$ #&%%&M_ DfE_ ԀAlloysConsidered:#&M%%#&8##XT"X%&M3#&M%XXT"0 SnCu,SnAgCuX { O$ O$ #&%%&MSummary:0 > 0 >O$>O$AIMsTechnicalDataSheetspresentthecharacteristicsofselectleadfreesolder 2 U  alloys.Thealloysrelevanttothescopeofthisreport#&M%%#&9##&%%&Mare:Sn0.7Cu,Sn3Ag0.5Cu  B  (LF218TM),and#&M%%#&:##&%%&MSn3.84.0Ag0.50.7Cu(_ TSC_ Ԅ4)#&M%%#&h;##&%%&M. /  O$ O$ #&M%%#&;##&%%&M TinCopper: TheSn0.7Cualloyishighinpuritywithahighmeltingtemperatureof227oC.Thiseutecticalloy   canbeusedforhightemperatureleadfreeapplications. TinSilverCopper: #&M%%#&L<##&%%&MTheSn3.84.0Ag0.50.7Cualloyhasalowmeltingpointof217218oC#&M%%#&~=##&%%&M,goodwetting  properties,#&M%%#& >##&%%&Mexcellentfatigueresistance,excellentsolderjointreliabilityandiscompatiblewithallfluxtypes.The  Sn3Ag0.5Cu(LF218TM)alloyalsohasameltingpointof217218oCand#&M%%#&~>##&%%&MԀ#&M%%#&?##&%%&Mfallsunderthe_ JEIDA_   recommendationforleadfreesoldering.Thesetwoternaryalloysare#&M%%#&?##&%%&MneardropinreplacementsforeutecticSn x 37Pbinbothwaveandhandsolderingapplications.#&M%%#&@##&%%&MInwavesoldering,boththesealloys#&M%%#&^A##&%%&Mproducelessdrossthan e othersolderalloys,wetwell,andprovidesuperiorjointstrength.InSMT(SurfaceMountTechnology)applications,theyproducestrongersolderjoints,havegreatermechanicalfatigueresistance,andaregoodsubstitutesfortheeutectictinleadalloy.#&M%%#&A##&%%&MAdditionally,the#&M%%#&9C##&%%&MSn3Ag0.5Cu#&M%%#&C##&%%&MandSn3.84.0Ag0.50.7Cu#&M%%#&C##&%%&MԀ#&M%%#&8D##&%%&Mnoclean ,O solderpastes#&M%%#&{D##&%%&Mpassall_ Bellcore_ ԀandIPCspecifications. < #&M%%#&D#ENEN(RefertoAppendixA,Table8)#XT"X%&My9#&M%XXT"  3 #&%%&M Q/t,0 Ї#&M%%#&FF#FNFN9.MaterialsandProcessConsiderationsforLeadFreeElectronicsAssembly   #&%%&MAuthor(s):0 > 0 >O$>O$Karl_ Seelig_   `#  2      *&-v%ـandDavid_ Suraski_  O$ O$ 0   0O$O$  Organization: > 0 O$O$AIM O$ O$ Publication/Source:0 4% \O  5  AIM:LeadfreeArticles^I#&M%%#&G##&%%&M ~ (I#&M%%#&I##&%%&Mhttp://www.aimsolder.com/lead_free.cfm?section=articles#2#&M%%#&8J##&%%&M6I\O#IX#  7%dQI)k O$ O$ Date:0  0>O$O$0 >O$>O$UndatedX { O$ O$ #&M%%#&J##&%%&M_ DfE_ ԀAlloysConsidered:#&M%%#&K##&%%&M##XX%#&E##&%X#X0 SnCu,SnAgCu#&M%%#&JL##&%%&ME h O$ O$ Summary:0 > 0 >O$>O$Thispaperpresentsanalysesoftinsilver,tincopper,andtinsilvercopperalloysand  B  comparesreliabilitytestingresultsandprocessconsiderationsforthem.Inordertoobtainreliabilityresults,thealloysweresubjectedtovariousthermalandmechanicalfatiguetests.#&M%%#&L##&%%&MԀThepaperalsobrieflydiscussescostandpatentissuesrelatedtothese   solders.  O$ O$ #&M%%#&N##&%%&M TinCopper: Whiletincoppersoldersmaybelesscostlythanthosecontainingsilver,thereareotherissuesto  consider.TheSn0.7Cu#&M%%#&^O##&%%&MԀalloyhasameltingtemperatureof227oC,prohibitingitsuseformanytemperature  sensitiveapplications.Itisalsoapoorwettingalloycomparedtootherleadfreesolders.Thiscouldrequiretheuseofnitrogenandaggressivefluxesformanyapplicationsandmayresultinwettingrelateddefects.Additionally,SnCutypicallyhaslowercapillaryactiontodrawitintobarrelsduringPlatedThroughHole(_ PTH_ )Technologyandlacksthefatigueresistanceneededforsurfacemountassembly.Finally,thepoorfatiguecharacteristicsofthisalloymayresultinfieldfailures,whichnegatesinitialcostsavingsprovidedbythislessexpensivealloy. TinSilverCopper: MostoftheworldseemstobelookingtotheSnAgCufamilyofalloysasasubstitutefor ' leadsolderalloys.TheSn4Ag0.5Cualloyhasameltingpoint#&M%%#&GP##&%%&Mof218oCanditsbasematerialsareabundantly  available.It#&M%%#&&T##&%%&Moffersverygoodfatiguecharacteristicsandgoodoveralljointstrength.#&M%%#&T##&%%&MWettingtestsdemonstrate  thatalloyswithlowersilvercontents(forexample,Sn2.5Ag0.7Cu0.5Sb#&M%%#&KU##&%%&M)wetstrongerandfasterthanthose  withhighersilvercontents(forexample,Sn4Ag0.5Cu#&M%%#&V##&%%&M).#&M%%#&V##&%%&MHowever,thesilvercontentofthisalloymakesitcost  prohibitiveforsomeapplications.Further,silvercontainingalloyshaveexperiencedfailureduringfatiguetesting,duetoaphasechangewhichcausesstructuralweakness.Thelowsilveralloyscanreducethisproblemandofferimprovedwettingandslightlylowermeltingtemperatures.Thelowsilveralloysareavailableworldwide,andprovidetheadvantagesoftheSnAgcufamilyofalloys,arelesscostprohibitive,andavoidtheproblemsassociatedwithSnCuanddualalloyprocesses. DualAlloyAssembly: ApartfromproblemsassociatedwithSn/Cu,intermixingSnAgCuandSnCusolders 5$X!$ mayresultinnonuniformlyalloyedsolderjoints.Thismaycausethejointtobesusceptibletofatiguefailureduetoinabilitytostressandstrainrelieve.Further,whenrepairsortouchupsareneeded,twoinventoriesofalloysarerequiredandoperatorsmustbesurenottomixthealloys.#&M%%#&V##&%%&M Reliability (%)  ThermalCyclingTesting:TestboardswerebuiltusingSn0.7CuandSn4Ag0.5Cuinconjunctionwith1206 )&* thinfilmresistors.Theboardswerethermallyshockedfrom40to125oCfor300,400and50015minutecycles. *'+ PosttestinspectionsshowthattheSnCualloyexhibitedsomecrackedsolderjointsasaresultofpoorwetting.Inaddition,wellformedsolderjointsmadefromtheSnCualloyalsoshowedcracksonthethirdsetofboards w-*. Їcycledto500repetitions.TheSn4Ag0.5Cualloy#&M%%#&+[##&%%&Montheotherhand,didnotshowanycracksduringtestingup  to500repetitions,demonstratingthatithassignificantlysuperiorthermalfatigueresistanceascomparedtoSnCu.However,itshouldbenotedthattheSn4Ag0.5Cu#&M%%#&]##&%%&MԀalloydidexhibitsomechangeingrainstructure  throughoutthejointsubsequenttothethermalcycling. MechanicalStrengthFlexTesting: Totestthesoldersmechanicalstrength,testboardswerebuiltusingthe ~ twoalloysinconjunctionwith1206thinfilmresistors,andweresubjectedtoflextesting.ThetestresultsshowthatsolderjointsproducedfromSn0.7Cucrackedduringflextesting,indicatingaweakjointthatisunabletowithstandawiderangeofmechanicalstresses.Onthecontrary,solderjointsproducedfromSn4Ag0.5Cupassedallflextestrequirements.GNGN(RefertoAppendixA,Table9)#&M%%#&_##&%%&M##XX%#&L##&%X#X  1      Q! Q< `  Q    #&M%%#&a#-F_' #&%%&M10.DatabaseforSolderPropertieswithEmphasisonNewLeadfreeSolders#&M%%#&Dc##&%%&MԀRelease4.0   #&M%%#&c##&%%&M- XX FX-0   0O$O$  Organization: > 0 O$O$NationalInstituteofStandards&Technology(_ NIST_ )andColoradoSchoolofMines  (_ CSM_ )  O$ O$ Publication/Source:0 4 \O  5  #&M%%#&6d#6e\Oe   7 f#&%%&MPropertiesofLeadFreeSolders ~ 4^fo \O  5  (Dg#&M%%#&f##&%%&Mhttp://www.boulder.nist.gov/div853/lead%20free/props01.html#&M%%#&g##&%%&M6f\O gdun  7fo7g)#&M%%#& h##&%%&Mk O$ O$ #&M%%#&h##&%%&MDated:0  0>O$O$0 >O$>O$February11,2002(lastupdated)#&M%%#& i#X { O$ O$ #&%%&MAlloysConsidered: SnPb,SnCu,SnAgCu,SnAgCuBi#&M%%#&i# E h (cSummary:0 > 0 >O$>O$Thisdatabasesummarizesthemechanicalandthermalpropertiesofleadfreealloysfrom  B  numeroussources.Thesedataweresummarizedinaseriesoftables.ExcerptsofthesetableshavebeenpresentedinAppendixA,illustratingthepropertiesofthetinleadsolderalongwiththreeleadfreesoldersincompositionsidenticalorsimilartothosebeingexaminedbythe_ DfE_ ԀPartnership.  O$ O$ Thissourcepresentsdataonthestrength,ductility,tensile,physical,andmechanicalproperties,shearstrengths,wettingangles,aswellasthermalpropertiesofmultiplesolderalloycompositions.NNHNHNNNHNHNNNHNHNNNHNHNNNHN(HNNNRefertoTables10.a.through10.g.inAppendixAfordatasummarytables.#XT"X%&M6b# 9NB ؂ ʂtj    [~  "    hq, n8Usdd8^ X   9NB   XXT" ZZ` AppendixA#XT"X tp# ; XXT"  #(9 ;nR ##XX9#(:p#p#&%X#X  Table1.a:PhysicalPropertiesofLeadfreeSolders,SummaryTable (Lauetal.) ##XX%#&p##&%X#X#&M%%#&np##&%%&M   q##XX%#&q##XT"XX#Xq#}*Id ddd X dd X Ldd L dd cdd cdd dd  dd }D%}D%,Ydd ,sdd ,Hdd ,7dd ,dd ,dd ,2dd +  *BB  R *WXXT"AlloyFamily DBB/!* "BB DSnPb DBB/!*  "BB DSnCu HBB3!*  "BB HSnAgCu GBB2$*  "BB GSnAgCuBi DB/!*  "BB DAlloyComposition DB|/!n  "B D63Sn37Pb DB|/!n "B| D99.3Sn0.7Cu D|/!n "B| D95.5Sn3.8Ag0.7Cu D|/! "| D95.5Sn4Ag0.5Cu DB|/! "| D95.4Sn3.1Ag1.5Cu DB|/! "B| D93.3Sn3.1Ag3.1Bi0.5Cu DB/! "B| D MeltingTemperature  b  (oC) cBP! B f@183f@c183 BqBb " f@183 f@B `l@227`l@227 {qBb " `l@227 `l@B  k@217 k@{217 _PBb "  k@217  k@ _217255 BB/!b " B216217 BB/!b "B B209212 AB,!b "B A SurfaceTension  V  (dyne/cm) BB/! !B B380at260o#T'WC, V " 417at233o#W#T'{##T'WC(air),  # 464at233oC(nitrogen) BB/!B $"B B491at277o#W#T'|##T'WC(air), V % 461at277o#W#T'|##T'WC  & (nitrogen) </!B '"B <#W#T'Q}#!#T'W >/!V (" >#W#T'}#!#T'W BB/!V )" B#W#T'w~#!#T'W BB/!V *"B B#W#T'~#!#T'W AB,!V +"B A Density  , (gm/cm3) BB/!6-B B8.36,8.4 dBQ!."B = ףp=@7.31= ףp=@d7.31 rC/" = ףp=@7.31 = ףp=@B @7.5@7.5 _PB0" @7.5 @ _7.44,7.39 BB/!1" B#W#T'#!#T'W BB/!2"B B7.56(Sn2Ag0.5Cu7.5Bi) AB,!64"B A ThermalConductivity  z5 (W/_ cm.oC_ ) BB/!*6B B0.509at30oC, z7 0.50at85oC BB/!*8"B B#W#T'$#Ԁ!*oflext#T'W  `#  3      </!z9"B <#W#T'@#!#T'W >/!z:" >#W#T'#!#T'W BB/!z;" B#W#T'#!#T'W BB/!z<"B B#W#T'!#!#T'W AB,!z="B A ElectricalResistivity  n> (#W#T'#2?W_ m#W?2_#O_ Ԅcm) BB/!?B B14.5,15.0,17 eBR!n@"B T@37543T@e1015 rDnA" T@37543 T@B  *@13*@13 rAnB"  *@13 *@ T@37543T@1015 eBRDnC" T@37543 T@ e BB/!nD"B B10.6(Sn3Ag3Cu2Bi) AB,!F"B A Hardness  lG (Vickershardness,kg/mm2(HV);Brinellhardness(BH)) BB/!|JB B12.8(HV),17(BH) BB/!lK"B B! </!lL"B <15(BH) >/!lM" >! BB/!lN" B! BB/!lO"B B34.5(Sn3Ag3Cu2Bi) ABB,!Q"B A _ CTE_ a `#  4      *! (_ ppm_ ) 4R  @ BBB/!tSBB B18.74,25,21,24#XT"XWOt#WXXT" BBB/!4T"BB B! @B/!4U"BB @14.83(Sn3Ag4Cu) @B/!pW"B @! BBB/!4X"B B! BBB/!4Y"BB B!#XT"XW2#1'%4Z"  BB 1#XXXXT"#7X#XSource:Lau##XX7#0##7X#XԀetal., ElectronicsManufacturingWithLeadFree,HalogenFree&ConductiveAdhesiveMaterials,September2000.#V7###7VԀ#V7#8##XT"XV~#; XXT" f[ #XT"X ;# &M%XXT"#&%%&M  V]  ZZ` <##XX%#&##&%X#X#&M%%#&##&%%&MTable1.b:CreepBehaviorofLeadfreeSolders,SummaryTable (Lauetal.)#&M%%#&##XT"X%&M#; XXT" L Oc}*/d IdYdd Ysdd sHdd H7dd 7dd dd 2dd 2cD%cD%,dd ,dd ,dd ,dd , dd ,dd +  #XT"X ;#&M%XXT" .BB z .#XT"X%&M#WXXT"AlloyFamily GBB2$R"BB GSnPb DBB/!R"BB DSnCu DBB/!R"BB DSnAgCu DBB/!R"BB D @ SnAgCuBi HB3!R"BB H AlloyComposition GB|2$" "B G63Sn37Pb DB|/!" "B| D99.3Sn0.7Cu DB|/!" "B| D95.5Sn3.8Ag0.7Cu DB|/!" "B| D @ 93.3Sn3.1Ag3.1Bi0.5Cu HB3!" "B| HCreepStrength f at0.1mm/min(N/mm2) U@2: RR B U20oC BB/!f B! cBP!f"B 333333!@8.6333333!@c8.6 BpBf" 333333!@8.6 333333!@B  *@13*@13 bBOAf"  *@13 *@B b! 1'!f"B 1 /  T /100oC BB/!,  B! cBP!, "B @2.1@c2.1 BoB, " @2.1 @B  @5@5 aBN@, "  @5 @B a! EB0!, "B ECreepat25oC ~  (_ MPa_ ) U@2. B U100htofailure BB/!~  B6(Sn40Pb) BB/!~ "B B! BB/!~ "B B27(Sn4Ag0.5Cu) BB/!~  "B B! 1'!~ !"B 1 / ^ ! /1000htofailure BB/! N " B2.8(Sn40Pb) BB/! N #"B B! BB/! N $"B B7.5(Sn4Ag0.5Cu)#XT"XW#WXXT" BB/! N %"B B! EB0! N &"B ETimetobreak  ' (_ MPa_ ) EB2$B (B E! BB/! )"B B! BB/! *"B B323(Sn1Ag0.5Cu);3,849(Sn3.5Ag0.75Cu) BB/!B ,"B B @ 218(SnAgCu7.5Bi);1747(SnAgCu4.5Bi);2203(SnAgCu2Bi) <BB'!f /"B < NumberofCyclestofailure = ףp `#  5      ^BBK6 0BB @3650@^3,650 BBsC6 1" @3650 @BB @1125@1,125 dBBQC6 2" @1125 @BB d @ 8,936( @ 95.4Sn3.1Ag1.5Cu) dBBQ!6 3"BB z@6522z@d @ 6,522#XT"XWB#SIG6 4" z@6522  z@BB S#XXXXT"#7X#XSource:##XX7###7X#XԀLauetal., ElectronicsManufacturingWithLeadFree,HalogenFree&ConductiveAdhesiveMaterials,September2000.#V7###7VԀ#V7###XT"XV\#; XXT" (5    7  ZZ` #XT"X ;#; XXT"T#(9 ;##XX9#(##&%X#Xable1.c:#&M%%#&:##XT"X%&M|#&M%XXT"MechanicalPropertiesofLeadfreeSolders,#XT"X%&M#&M%XXT"SummaryTable#XT"X%&MY#; XXT"Ԁ#(9 ;##XX9#(##&%X#X (Lauetal.) #&M%%#&Ȫ##XT"X%&M #; XXT"  : آ#(9 ;##XX9#(##7X#X##XX7#-##(9X#X#; 9#(#*d/ddd dd dd dd  dd dd cD%cD%, dd ,fdd ,dd ,|dd ,dd ,dd ,Pdd +  .BB @ .#XT"X ;p#WXXT"AlloyFamily GBB2$"BB GSnPb DBB/!"BB DSnCu DBB/!"BB DSnAgCu DBB/!"BB DSnAgCuBi EB0!"BB EAlloyComposition GB|2$\ "B G63Sn37Pb DB|/!\ "B| D99.3Sn0.7Cu DB|/!\ "B| D95.5Sn3.8Ag0.7Cu DB|/!\ "B| D93.3Sn3.1Ag3.1Bi0.5Cu EB0!\ "B| EUltimateTensileStrength(_ MPa_ ) EB2$,B E1956 `#  6      bBO!,"B  7@237@b23 bBOA,"  7@23 7@B b48;48.5(95.4Sn3.1Ag1.5Cu) bBO!P "B  S@78S@b78 eBPA,"  S@78 S@B eYieldStrength(_ MPa_ ) EB2$ B E27.237 `#  7      bBO! "B  B@37B@b37 BoA "  B@37 B@B  F@45F@45 bBOA "  F@45 F@B b85.3(Sn2Ag7.5Bi0.5Cu) EB0! "B EYoungsModulus(_ GPa_ ) EB2$ dB E38.1(70oC),  d 30.2(20oC),    19.7(140oC), 8  32,33.58,35,15.7,31.03 BB/!$ "B B! BB/! d"B B! @ BB/! d "B B! EB0! d!"B EElongation(%) EB2$h "B E3158.87K `#  8     , h # 35176 `#  9      bBO! $"B  F@45F@b45 bBOAh %"  F@45 F@B b @ 36.5(95.4Sn3.1Ag1.5Cu) bBO! '"B  3@193@b19 \BGAh ("  3@19 3@B \ Shear \) Strength(_ MPa_ ) D/)0+"aa B Dat0.1mm/min @+)\,"  @20oC ]BJ\-  7@237@]23 wBdR\."   7@23 7@B w2023 sB`2\/"B  ;@27;@s27 @ fBSA\0"  ;@27 ;@B f! B82\1" B B  <1  # <1 #100oC YBF2  ,@14,@Y14 bBOA3"  ,@14 ,@B b1621 bBO!4"B  1@171@b17 @ bBOA5"  1@17 1@B b! 1'!6"B 1 ' 6 'at0.1mm/min;gapthickness:76.22?Wm#W?2=#m; 8 coolingrate=10o/s @+)N9 WW* @22oC 9B&X: 936.5(Sn40Pb) dBQ!X;"B =@29.8=@d29.8 BsCX<" =@29.8 =@B fffffO@63.8fffffO@63.8 @ dBQCX=" fffffO@63.8 fffffO@B d! 1'!X>"B 1  K>  # K> #170oC 9B&;? 94.5(Sn40Pb) dBQ!;@"B 333333$@10.1333333$@d10.1 BsC;A" 333333$@10.1 333333$@B 9@25.19@25.1 @ dBQC;B" 9@25.1 9@B d! 1'!;C"B 1 ' .C 'at1mm/minat_ reflow_ Ԁtemperature(RT) <B)D <34.5(Sn40Pb) BB/!E"B B28.5(Sn1Cu) BB/!F"B B! @ BB/!G"B B! 1'!H"B 1 ' rH 'at1mm/minat100oC <B)JI <21.6(Sn40Pb) BB/!JJ"B B21.2(Sn1Cu) BB/!JK"B B! @ BB/!JL"B B! 1'!JM"B 1 ' *M 'Byringandplugtest _BLN (\"D@40.27(\"D@_40.27 eBRDO" (\"D@40.27 (\"D@B e! BB/!P"B B! @ BB/!Q"B B! <BB'!R"B < ImpactStrength(J/cm2) \BBI^SBB  ?@31?@\31 bBBOA^T"  ?@31 ?@BB b! BBB/!^U"BB B77(Sn3.5Ag0.75Cu) @ BBB/!W"BB B!#XT"XW#; XXT"1'%^X" BB 1#(9 ;##XX9#(##7X#XSource:Lauetal., ElectronicsManufacturingWithLeadFree,HalogenFree&ConductiveAdhesiveMaterials,September2000.#V7#H##7VԀ#V7#P##XT"XV#; XXT" Y   d[   x<`      #(9 ;##XX9#(##&%X#X  #&M%%#&m##&%%&M##XX%#&##&%X#XTable1.d:WettingPropertiesofLeadfreeSolders,SummaryTable (Lauetal.)#&M%%#&##XT"X%&MC#; XXT" L u*}dd dd fdd fdd |dd |dd dd Pdd PcD%cD%,!dd ,dd ,pdd ,dd ,xdd ,dd ,dd ,xdd +  .BBB z .#XT"X ;#; XXT"#(9 ;  WettingProperties#; 9#(##XT"X ;#WXXT" KB6$R BBB K-  AlloyFamily KB6$8"B K @ SnPb KB6$8"B KSnAgCu GB2$8"B GSnAgCuBi HB3!8"B HAlloyComposition G|2$| "B G60Sn40Pb#T'W DB|/!| "| D62Sn38Pb D|/!| "B| D95.5Sn3.8Ag0.7Cu DB|/! , "| D95.5Sn4.7Ag1.7Cu DB|/! ,"B| DSn3.3Ag3Bi1.1Cu HB3! ,"B| HContactAngle(degrees) YD2 "}}/B Y! \R$ p  1@171@\17#W#T'##T'W bBOA p"  1@17 1@ b!#W#T'y##T'W 9/! p"B 9! bBO! p"  5@215@b21 bBOA p"  5@21 5@B b!#W#T'!##T'W 1'! p"B 1 3  P 3FluxA611,260280oC _R$(   6@226@_22#W#T'j##T'W bBOA( "  6@22 6@ b!#W#T'##T'W </!( "B <!#W#T'3##T'W bBO!( "  G@47G@b47 bBOA( "  G@47 G@B b!#W#T'##T'W 1'!( "B 1 3   3FluxA260HF,260280o#W#T'##T'WC _R$l   @@32@@_32#W#T'##T'W bBOAl !"  @@32 @@ b!#W#T'&##T'W </!l ""B <!#W#T'##T'W bBO!l #"  F@45F@b45 bBOAl $"  F@45 F@B b!#W#T'P##T'W 1'!l %"B 1 3 L % 3FluxB2508,260280o#W#T'\##T'WC cR$< &  ?@31?@c31#W#T'##T'W bBOA< '"  ?@31 ?@ b!#W#T'##T'W @/!< ("B @!#W#T'l##T'W bBO!< )"  A@35A@b35 bBOA< *"  A@35 A@B b!#W#T'##T'W HB3!< +"B HWettingTime  , at260o#W#T'##T'WC#W#T'##XT"XW##XXXXT"#T'X#X 0 - Ѐ(seconds)#W#T'##T'W YD2T ."aa,7B YImmersionPbPCB <2$ / <!#W#T'##T'W BB/! 0" B0.36(at235o#W#T'##T'WC#W#T'##T'W##XX#T';##T'X#X) [Q! 1"B Q?0.28Q?[0.28#W#T'a##XT"XW#WXXT"#T'W dBQC 2" Q?0.28 Q? d!#W#T'##T'W dBQ! 3"B Q?0.24Q?d0.24 SIC 4" Q?0.24 Q?B S 3 ` 4 3ImmersionSnPCB ?2$8 5 ?!#W#T'1##T'W BB/!8 6" B0.27(at235o#W#T'##T'WC#W#T'K##T'W##XX#T'h##T'X#X)#W#T'##T'W##XX#T'##T'X#X ^Q!8 7"B q= ףp?0.23q= ףp?^0.23#W#T'##XT"XWU##XXXXT"#T'X#X dBQC8 8" q= ףp?0.23 q= ףp? d!#W#T'##T'W dBQ!8 9"B p= ף?0.26p= ף?d0.26 SIC8 :" p= ף?0.26 p= ף?B S 3 : 3ImmersionAgPCB ?2$|; ?!#W#T'##T'W BB/!|<" B0.20(at235o#W#T'h##T'WC#W#T'##T'W##XX#T';##T'X#X)#W#T'B##T'W##XX#T'##T'X#X ^Q!|="B ?0.25?^0.25#W#T'##XT"XW ##XXXXT"#T'X#X dBQC|>" ?0.25 ? d!#W#T'##T'W dBQ!|?"B RQ?0.19RQ?d0.19 SIC|@" RQ?0.19 RQ?B S 3 \@ 3_ NiAu_ ,PCB ?2$LA ?!#W#T'##T'W BB/!LB" B0.32(at235o#W#T'5##T'WC#W#T'##T'W##XX#T'##T'X#X)#W#T'##T'W##XX#T'Q##T'X#X ^Q!LC"B zG?0.42zG?^0.42#W#T'##XT"XW##XXXXT"#T'X#X dBQCLD" zG?0.42 zG? d!#W#T'##T'W dBQ!LE"B )\(?0.44)\(?d0.44 SICLF" )\(?0.44 )\(?B S 3 ,F 3_ OSP_ Ԁ1 ?2$G ?!#W#T'f##T'W BB/!H" B0.20(at235o#W#T'##T'WC#W#T'##T'W##XX#T'##T'X#X)#W#T'##T'W##XX#T'##T'X#X ^Q!I"B p= ף?0.26p= ף?^0.26#W#T']##XT"XW##XXXXT"#T'X#X dBQCJ" p= ף?0.26 p= ף? d!#W#T'f##T'W dBQ!K"B p= ף?0.26p= ף?d0.26 SICL" p= ף?0.26 p= ף?B S 3 pL 3_ OSP_ Ԁ2 ?2$HM ?!#W#T'/##T'W BB/!HN" B0.21(at235o#W#T'##T'WC#W#T'^##T'W##XX#T'##T'X#X)#W#T'##T'W##XX#T'##T'X#X ^Q!HO"B q= ףp?0.23q= ףp?^0.23#W#T'&##XT"XWh##XXXXT"#T'X#X dBQCHP" q= ףp?0.23 q= ףp? d!#W#T'/##T'W dBQ!HQ"B ?0.25?d0.25 SICHR" ?0.25 ?B S 3 (R 3_ OSP_ Ԁ3 C2$S C!#W#T'##T'W BB/!T" B0.24(at235o#W#T'##T'WC#W#T'+##T'W##XX#T'N##T'X#X)#W#T'n##T'W##XX#T'##T'X#X bQ!U"B HzG?0.27HzG?b0.27#W#T'##XT"XW5##XXXXT"#T'X#X dBQCV" HzG?0.27 HzG? d!#W#T'##T'W dBQ!W"B HzG?0.27HzG?d0.27 jBBUCX" HzG?0.27 HzG?B jSpread YD2\Y"))H>BB Y_ OSP_ Ԁ3 U@2\Z, UA 9/!\[" 9!#W#T'##T'W dBQ!\\" 333333@4.55333333@d#W#T'##T'W4.55 |rC\]" 333333@4.55 333333@B @4.2@|4.2 cBPB\^" @4.2 @ c!#W#T'##T'W aBN!\_"B  @4@a4 PF@\`"  @4 @B P  <`  / <` /B </!a" <!#W#T'##T'W aBN!b"  @5@a5 }p@c"  @5 @B ffffff@4.35ffffff@}4.35 dBQCd" ffffff@4.35 ffffff@ d!#W#T'F##T'W dBQ!e"B @4.45@d4.45 SICf" @4.45 @B S 3 f 3ImmersionAg U@2Xgz@ UA </!Xh" <!#W#T'##T'W cBP!Xi" @4.7@c4.7 rBXj" @4.7 @B 333333@4.55333333@4.55 dBQCXk" 333333@4.55 333333@ d!#W#T'##T'W cBP!Xl"B ffffff@4.6ffffff@c4.6 RHBXm" ffffff@4.6 ffffff@B R  8m  / 8m /B </!(n" <!#W#T'8##T'W cBP!(o" @4.7@c4.7 ~qB(p" @4.7 @B 333333@4.8333333@~4.8 cBPB(q" 333333@4.8 333333@ c!#W#T'##T'W dBQ!(r"B @4.95@d4.95 SIC(s" @4.95 @B S 3 |s 3Immersion_ Pd_  U@2ltB UA </!lu" <!#W#T'N##T'W cBP!lv" @4.4@c4.4 ~qBlw" @4.4 @B 333333@3.9333333@~3.9 cBPBlx" 333333@3.9 333333@ c!#W#T'@##T'W cBP!ly"B @4.4@c4.4 RHBlz" @4.4 @B R  Lz  / Lz /B </!${" <!#W#T'##T'W cBP!$|" @4.7@c4.7 ~qB$}" @4.7 @B 333333@3.9333333@~3.9 cBPB$~" 333333@3.9 333333@ c!#W#T'V ##T'W dBQ!$"B @4.65@d4.65 SIC$" @4.65 @B S 3B   3_ NiAu_  U@2h DB UA </!h " <!#W#T' ##T'W aBN!h "  @5@a5 |o@h "  @5 @B @4.4@|4.4 cBPBh " @4.4 @ c!#W#T' ##T'W cBP!h "B @4.7@c4.7 RHBh " @4.7 @B R  H!  /B H! /B @B/!!8"B @!#W#T'Z##T'W aBBN!!8"B  @5@a5 ~Bm@!8"  @5 @BB  @5@~5 aBBN@!8"  @5 @B a!#W#T'##T'W aBBN!!8"BB  @5@a5##XX#T'##(9X#XPFD!8"  @5  @BB P#; 9#(l##XT"X ;#WXXT"#T'W##XX#T'##7X#XSource:Lauetal., ElectronicsManufacturingWithLeadFree,HalogenFree&ConductiveAdhesiveMaterials,September2000.#V7###7VԀ##XX7#8##XT"XX#X#WXXT" <# Key:APeak240oC,dwell60sforPbfree,215oC,60sdwellforSnPbAg,scale1to5(best),forcedairconvection,air. :%! BPeak240oC,dwell60sforPbfree,215oC,60sdwellforSnPbAg,scale1to5(best),230oC_ bp_ Ԁ_ VPR_ .#XT"XWf##XXXXT"#&%X#X %v" ##XX%#&8##7X#X#V7###XT"XV#; XXT"#(9 ;  (P%   ##XX9#(#   #XT"XX#X##XXXXT"#&%X#X ZZ` %7(Table2:TinSilverCopperSolderJointReliabilityComparedwithSnPb,SummaryTable (_ Ochiai_ Ԁetal.) #&M%%#&##XT"X%&M#; XXT"#(9 ; L  ~*d}d!dd !dd pdd pdd xdd xdd dd xdd xcF%cF%,dd ,dd ,2dd ,dd ,Ydd ,Ydd +  .BB z .##XX9#(-##T'X#XAlloy R Family#W#T'L##T'W YBD2"yFBB Y @ TemperatureDependence GBB2$R"B G_ QFP_ Ԁsolderjoints 1'!R"BB 1 /| 2 / ShearModulus  " (atincreasingtemperature) D|/! "| D Deformation  "  (twistingvelocitybelow1rad/s)#W#T'##T'W D|/! "| DHardening D|/!""| DFatiguelife DB|/!""| DFatiguelife IBB4!""B| /ISnPb @B/!: "BB @decreases(atalargerratethanSnAgCu) @B/! v"B @easilydeformed @B/!: "B @! BB/!: "B B! BBB/!: "B B! IBB4&: " / BB ISnAgCu @B/!i "BB @decreases(atasmallerratethanSnPb)#W#T'B##T'W @B/! "B @moredifficulttodeform(thanSnPb) @B/! "B @lesslikelytoharden(thanSnPb) BB/! "B B10,000cycles(almosttwiceSnPb) BBB/! "B Bsuperior(toSnPb)withcontrolledBicontamination##XX#T'{#1'% U #"  BB 1#7X#X#V7#"#Source:#7V_ Ochiai_ Ԁetal., ReliabilityofSolderJointsAssembledwithLeadFreeSolder G $ #V7#d$##7V##XX7#$#k  #T'X#X##XX#T'%##&%X#X#&M%%#&1%##&%%&M##XX%#&%##&%X#XTable3:Tensile,Fatigue,andCreepPropertiesofLeadfreeAlloys,SummaryTable (W._ Plumbridge_ )#&M%%#&&##&%%&M##XX%#&Y&# ( #XT"XX#X '#%k#XXXXT"#&%X#X*pdddd dd 2dd 2dd Ydd YYdd YcS%cS%,Zdd ,dd ,dd ,!dd ,dd ,bdd ,fdd +  .BB q* .##XX%#&'##T'X#XAlloy I+ Family YBD2," HBB YTensileProperties KB6$I-"B KFatigueTests `#  10      YBBD2I."*B YCreepPropertiesS `#  11      4*$I/"BB 4 /| )/ / @ ElongationtoFailure A|,!=1"| ADuctility A|,!2"| ATensileStrength `#  12      HSS}3!=4"| H >|))4SS} >CreepBehavior 5 (at75o#W#T''##T'WC) AB|,!=6"| ATimetoRupture DBB/!7"B| DSnPb @B/! 8"BB @!#W#T'1.##T'W @B/! 9"B @!#W#T'R/##T'W BB/! :"B Bbelow10MPa#W#T'/##T'W BB/! ;"B Bsoftening(1520%) @B/! <"B @!#W#T'g0##T'W BBB/! ="B B!#W#T'A1##T'W DBB/! >"BB DSnCu @B/!Q?"BB @ @ ! @B/!Q@"B @comparativelymostductile BB/!uB"B Bbelow10MPa(weakest#W#T'1##T'W) BB/!uD"B Bsoftening(1520%)#W#T'R3##T'W @B/!QE"B @similartoSn37Pb BBB/!uG"B BlowercreepductilitythanSn37Pb DBB/!uI"BB DSnAgCu @B/!EJ"BB @ @ comparativelysmallest @B/!iL"B @2055% BB/!EM"B Bcomparativelystrongest BB/!iO"B Bsoftening(1520%)#W#T'3##T'W @B/!EP"B @greatercreepresistance BBB/!iR"B Bextremelysensitivetostress##XX#T')##(9X#X1'%iT"  BB 1#; 9#(6##(9 ;##XX9#(z7##7X#X##XX7#58##XT"XX#X7##XXXXT"#7X#XSource:WilliamJ._ Plumbridge_ ,TheSolder_ Programme_ ԀattheOpenUniversityMaterials,EngineeringDepartment:AnUpdate,2001#V7#8##7V sU 4c\O  5  (?:#V7#9##7Vhttp://technology.open.ac.uk/materials/mathp.html69\:@4*N*N  7w 2:)#V7#:##7V##XX7#8##(9X#X V ##XX9#(;##T'X#X#W#T'h;#  #XT"XW<#&M%XXT"#XT"X%&Mz<#&M%XXT"Table4:TensileandCreepBehaviorofTwoSnAgCuAlloysintheRapidlyCooled,AsCastState, [ Z SummaryTable#&%%&MԀ (_ Kariya_ Ԁand_ Plumbridge_ )##XX%#&<##(9X#X 3![ G<*}dpdZdd Zdd dd !dd !dd bdd bfdd fcS%cS%,|dd , 'd ,dd , dd +  *BB "a] *##XX9#(=##T'X#XAlloyComposition DB/!9#^"BB D TensileStrength `#  13       9#_ (Strainrate:103/s;348K) DB/!#u `"B D CreepResistance `#  14      DBB/!9#a"B D TimetoRupture  9#b (Stresscomponent:approx.14) DBB|/!#u c"BB DSn3Ag0.5Cu BB/!-%!d"BB| BL Vbcdefghi]Ahy bcdefghiLhigherthanSn3.5Ag(by20%);doubleSn0.5Cu BB/!%i"f"B BbetterthanSn3.5Ag BBB/!-%!g"B BsimilartoSn3.8Ag0.7Cu;superiorthanSn3.5Ag(x20) DBB|/!%i"i"BB DSn3.8Ag0.7Cu BB/!!'#j"BB| Bdecreases(withincreasingtemperature&decreasingstrainrate) BB/!']$l"B BbetterthanSn3.5Ag BBB/!!'#m"B B!##XX#T'?##(9X#X1'%!'#n"  BB 1#; 9#(_=##XT"X ;E#VXXT"#7VSource:_ Yoshiharu_ Ԁ_ Kariya_ ԀandWilliamJ._ Plumbridge_ , #V7#RF##7VMechanicalPropertiesofSn3.0mass%Ag0.5%mass%CuAlloy,#V7#-G##7VMaterialsEngineeringDepartment,The O)%o OpenUniversity,U.K.#V7#G##7V##XX7#3F# #&%X#X  ##XX%#&H##&%X#X#&M%%#&?H##&%%&M c+'r %  ZZ` 8Usdd8   _ Table5:TinSilverCopperSolderPerformanceComparedwithSnPb,SummaryTable (Shengetal.) #&M%%#&G##XT"X%&MG#; XXT"#(9 ;  L #; 9#(G#E#(9 ;*d}d|dd | 'd dd  dd cS%cS%,( dd , dd , dd +  *BB z *##XX9#(tG##T'X#XAlloyFamily DBB/!R"BB DSnPb DBB/!R"BB DSnAgCu#W#T'G##T'W DB/!R"BB DSolderPasteAlloyComposition DB|/!""B DSn37Pb#W#T'FJ##T'W DB|/!""B| DSn3.5Ag0.5Cu#W#T'5K##T'W AB,!" "B| AUltimateTensileStrength#W#T'K##T'W BB/!f B B! BB/!f "B BslighterlowerthanSn37Pb#W#T'eL##T'W AB,!f "B AYieldStrength#W#T'JM##T'W BB/!  B B!#W#T'M##T'W BB/! "B BslighterlowerthanSn37Pb#W#T'cN##T'W AB,! "B ACreepPerformance#W#T'O##T'W BB/!b B B!#W#T'O##T'W BB/!b "B BsuperiortoSn37Pb#W#T'P##T'W AB,!b "B AWettingProperties#W#T'P##T'W BB/! 2 B Bcomparable#W#T'JQ##T'W BB/! 2 "B Bcomparable#W#T'Q##T'W AB,! 2 "B AViscosity(Static&Dynamic#W#T'fR##T'W) BB/! v B Bsimilar#W#T'S##T'W BB/! v "B Bsimilar#W#T'S##T'W AB,! v "B ATack#W#T'T##T'W BB/!. B Bsimilar#W#T'T##T'W BB/!. "B Bsimilar#W#T'-U##T'W AB,!. "B ASolderability BB/!r B Bsimilar#W#T'U##T'W BB/!r "B Bsimilar#W#T'V##T'W AB,!r "B AReflowCharacteristics#W#T'W##T'W BB/!BB Bsimilar#W#T'W##T'W BB/!B "B Bsimilar#W#T'@X##T'W ABB,!B!"B APrintlife#W#T'X##T'W BBB/!"BB B!#W#T'XY##T'W BBB/!#"BB BlongerthanSn37Pb#W#T'Y##T'W##XX#T'cI##(9X#X1'%$" BB 1#; 9#(wZ##(9 ;##XX9#(Z##7X#X#V7#,[##7VSource:QuanSheng,CharlesBradshaw,SandyKwiatek#V7#[##7V, PropertiesofLeadFreeAlloyandPerformancePropertiesofLeadFreeNoCleanSolderPaste#V7#)\##7V,#V7#\##7VOMG x% Americas,2002##XX7#n[##&%X#X & ##XX%#&]##XT"XX#X]##XXXXT"#&%X#X  ##XX%#&^##&%X#X#&M%%#&]##&%%&MTable6:CreepBehaviorandWettabilityofThreeSolderAlloys,SummaryTable (Grusd##XX%#&k^##&%X#XandJorgensen)#&M%%#&^##XT"X%&MG_#&M%XXT"#&%%&M d) 8^*pd d( dd ( dd  dd  cS%cS%,dd ,dd ,sdd ,]dd , dd +  *BB + *##XX%#&_##T'X#XAlloy |, Family DB/!,-"BB DAlloyComposition DB/!|."B DMeltingTemperature(#W#T'_##T'Wo#W#T'b##T'WC#W#T'b##T'W) DB/!,0"B DCreep/Fatigue DBB/!|1"B DWettability DBB/!|2"BB DSnPb DB|/!p3"BB DSn37Pb cBP!p4"B| f@183f@c183 cBPBp5" f@183 f@B c!#W#T'#c##T'W BBB/!p6"B B!#W#T'ie##T'W DBB/!p7"BB DSnCu#W#T'e##T'W DB|/!@8"BB D99.3Sn0.7Cu#W#T'|f##T'W cBP!@9"B| `l@227`l@c227#W#T'g##T'W cBPB@:" `l@227 `l@B csuperiorthanSnPb BBB/!@;"B Binferiorcopperwetting(comparedwitheutecticSnPb) DBB/!d="BB DSnAgCu#W#T'g##T'W DB|/!4>"BB D95.5Sn4.0Ag0.5Cu#W#T'2i##T'W BB/!4?"B| B217219#W#T'i##T'W BB/!4@"B B! 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B/!~ " B! ZP!~ " f@183f@Z183 qB~ " f@183 f@ f@183f@183 cBPB~ " f@183 f@ c! FSBS3!~ "B F >B|)^ SBS >Sn40Pb bBQ!N "B| 33333B@37.433333B@b37.4 BpCN !" 33333B@37.4 33333B@B @B@36.5@B@36.5 BoCN "" @B@36.5 @B@B @4.5@4.5 BqBN #" @4.5 @B f@183f@183 BnBN $" f@183 f@B g@188g@Ѐ188 BBpBN %" g@188 g@B  1@171@17 dBBOAN &"  1@17 1@BB dSnCu DB|/! '"BB DSn0.7Cu @B/! ("B| @! bBQ! )"B =@29.8=@b29.8 BsC *" =@29.8 =@B 333333$@10.1333333$@10.1 BrC +" 333333$@10.1 333333$@B `l@227`l@227 cBPB ," `l@227 `l@B c! BBB/! -"B B! HBB3! ."BB HSnAgCu U|@2J /"llBB USn3.6Ag1Cu YO!J 0"|  K@54K@Y54 ~oAJ 1"  K@54 K@  P@67P@~67 qAJ 2"  P@67 P@ ffffff8@24.4ffffff8@24.4 |rCJ 3" ffffff8@24.4 ffffff8@  k@217 k@|217 sBJ 4"  k@217  k@ |)*6SS} >Sn3.8Ag0.7Cu </!7"| <! ]N!8" fffffO@63.8fffffO@]63.8 pC9" fffffO@63.8 fffffO@ 9@25.19@25.1 rC:" 9@25.1 9@  k@217 k@217 `MB;"  k@217  k@ `! BB/!<" B! HSS}3!="B H >B|)n=SS} >Sn4.7Ag1.7Cu `BO!^>"B|  G@47G@`47 }BlA^?"  G@47 G@B  M@58M@}58 BnA^@"  M@58 M@B 5@21.65@21.6 BrC^A" 5@21.6 5@B  k@217 k@217 `BMB^B"  k@217  k@B `! bBBO!^C"B  5@215@b21##XX#T'Z#QGE^D"  5@21 5@BB Q#7X#X#V7#MX#X#7V##XX7#7v##7X#XSource:_ NIST_ Ԁand_ CSM_ , DatabaseforSolderPropertieswithEmphasisonNewLeadfreeSolders#V7#v##7V,#V7#w##7VԀFebruary2002,#V7#x##7V PE v4c\O  5  (x#V7#Yx##7V##XX7#v##7X#Xhttp://www.boulder.nist.gov/div853/lead%20free/props01.html#V7#8y##XT"XVzy##XXXXT"6x\Ox   7ex#7X#X)z##XX7#z##XT"XX#Xz##XXXXT"#&%X#X zF ##XX%#&A{##(9X#X#; 9#("{##(9 ;##XX9#({#  #&%X#X#&M%%#&{##&%%&M{Table10.e:ThermalPropertiesofCandidateLeadFreeSolders,SummaryTable (_ NIST_ Ԁand_ CSM_ )##XX%#&@|##(9X#X#; 9#(|##(9 ;| jL 1|*d pddd bdd btdd tDdd D7dd 7xdd xxdd xdd cS%cS%,dd ,dd ,dd ,vdd ,{dd +  *BB  N *##XX9#(}##T'X#XAlloyFamily DB/!pO"BB DAlloyComposition DB/!pP"B DLiquidusTemperature(oC) DB/!pQ"B D_ Reflow_ ԀTemperature(oC) DBB/!pR"B DMeltingRange(oC) DBB/!pS"BB DSnCu DB|/!@T"BB DSn0.7Cu cBP!@U"B| `l@227`l@c227 cBPB@V" `l@227 `l@B c245255 cBBP!@W"B `l@227`l@c227 iBBTB@X" `l@227 `l@BB iSnAgCu U|@2Y"AABB USn3.2Ag0.5Cu cP!Z"| @k@218@k@c218 cPB[" @k@218 @k@ c238248 BB/!\" B217218 1'!]"B 1 /| d] /Sn3.5Ag0.75Cu cP!< ^"| @k@218@k@c218 cPB< _" @k@218 @k@ c238248 BB/!< `" B! 1'!< a"B 1 /| !a /Sn3.8Ag0.7Cu cP!! b"| k@220k@c220 cPB! c" k@220 k@ c238248 BB/!! d" B217220 1'!! e"B 1 /| `"e /Sn4Ag0.5Cu B/!"Pf"| B! B/!"Pg" B! BB/!"Ph" B217225 1'!"Pi"B 1 /B| #0 i /Sn4Ag1Cu cBP!$ j"B| k@220k@c220 cBPB$ k" k@220 k@B c238248 BBB/!$ l"B B217220 HBB3!$ m"BB HSnAgCuBi U|@2L%!n"BB USn3.5Ag0.7Cu5Bi B/!L%!o"| B! B/!L%!p" B! BB/!L%!q" B198213 1'!L%!r"B 1 /B| ,&"r /Sn3.2Ag1.1Cu3Bi cBP!&#s"B| n@240n@c240 cBPB&#t" n@240 n@B c230240 BBB/!&#u"B B!##XX#T'##(9X#X1'%&#v"  BB 1##XX9#({##7X#X#V7#}##XT"XV##XXXXT"}#7X#XSource:_ NIST_ Ԁand_ CSM_ , DatabaseforSolderPropertieswithEmphasisonNewLeadfreeSolders#V7#W##7V,#V7#{##7VԀFebruary2002,#V7###7V ($w 4c\O  5  (#V7###7V##XX7###7X#Xhttp://www.boulder.nist.gov/div853/lead%20free/props01.html#V7###XT"XV7##XXXXT"6[\o*N*N  7e#7X#X)~##XX7#_##XT"XX#Xڒ##XXXXT"#&%X#X (8%x ##XX%#& ##(9X#X#; 9#(##(9 ; ##XX9#(b##&%X#X p-)~ ( ln   #&M%%#&##XT"X%&M#&M%XXT"#&%%&M  #&M%%#&@##&%%&M0##XX%#&##&%X#XTable10.f:TernarySnAgCuElasticPropertiesvs.Temperature,SummaryTable ##XX%#&##XT"XX#X##XXXXT"”#&%X#X(_ NIST_ Ԁand_ CSM_ )##XX%#&##(9X#Xߕ#; 9#(##(9 ; L _*pd ddd dd dd vdd v{dd {cS%cS%,Ldd ,kdd ,Udd ,dd ,dd ,^dd ,dd +  .BB z .##XX9#(##T'X#XElasticProperty \BBG5R"!BB \TestTemperature(oC) 4*$R"BB 4 P|; 2 9-259PЄ25 |mB"" 9-25 9|  9@259@25 |lA""  9@25 9@|  R@75R@75 |mA""  R@75 R@| @_@125@_@125 B|nB" " @_@125 @_@| d@160d@160 iB|TB" " d@160 d@B| iYieldStress f  AsCast(_ MPa_ ) U|@2:  B| UMinimum \R!f| zGD@41.51zGD@\41.51 uDf" zGD@41.51 zGD@ zG!>@30.13zG!>@30.13 uDf" zG!>@30.13 zG!>@ 33333s0@16.4533333s0@16.45 uDf" 33333s0@16.45 33333s0@ q= ף*@13.47q= ף*@13.47 BtDf" q= ף*@13.47 q= ף*@ (\B#@9.63(\B#@9.63 SICf" (\B#@9.63 (\B#@B S ,|  F ,Mean `S! | (\D@41.645(\D@`41.645 tE " (\D@41.645 (\D@ (\?@31.835(\?@31.835 tE " (\?@31.835 (\?@ 4@20.9754@20.975 tE " 4@20.975 4@ QE+@13.635QE+@13.635 BsE " QE+@13.635 QE+@ zGa$@10.19zGa$@10.19 TJD " zGa$@10.19 zGa$@B T ,|   ,Maximum cR!b | p= D@41.78p= D@c41.78 rDb " p= D@41.78 p= D@ Q@@33.54Q@@33.54 qDb " Q@@33.54 Q@@ 9@25.59@25.5 pCb " 9@25.5 9@ +@13.8+@13.8 BqCb " +@13.8 +@ %@10.75%@10.75 kB|VDb " %@10.75 %@B kYieldStress  2  Aged(_ MPa_ ) U|@2 "B| UMinimum \R! 2 #| (\bB@36.77(\bB@\36.77 uD 2 $" (\bB@36.77 (\bB@ (\55@21.21(\55@21.21 uD 2 %" (\55@21.21 (\55@ Q0@16.97Q0@16.97 uD 2 &" Q0@16.97 Q0@ Qk%@10.71Qk%@10.71 BuD 2 '" Qk%@10.71 Qk%@ Gz%@10.79Gz%@10.79 TJD 2 (" Gz%@10.79 Gz%@B T ,|   ( ,Mean `S! v )| p= SC@38.655p= SC@`38.655 tE v *" p= SC@38.655 p= SC@ 5@21.9255@21.925 tE v +" 5@21.925 5@ zG1@17.005zG1@17.005 sE v ," zG1@17.005 zG1@ L(@12.15L(@12.15 BrD v -" L(@12.15 L(@ 33333&@11.3533333&@11.35 TJD v ." 33333&@11.35 33333&@B T ,| V . ,Maximum cR!. /| QED@40.54QED@c40.54 rD. 0" QED@40.54 QED@ p= ף6@22.64p= ף6@22.64 rD. 1" p= ף6@22.64 p= ף6@  ףp= 1@17.04 ףp= 1@17.04 rD. 2"  ףp= 1@17.04  ףp= 1@ Gz.+@13.59Gz.+@13.59 BrD. 3" Gz.+@13.59 Gz.+@ R'@11.91R'@11.91 kB|VD. 4" R'@11.91 R'@B kElasticModulus r 5 AsCast(_ MPa_ ) U|@2^7.B| UMinimum ]S!r 8| 33333_@2863.633333_@]2863.6 wEr 9" 33333_@2863.6 33333_@ \@4956.5\@4956.5 wEr :" \@4956.5 \@ 33333k@4021.633333k@4021.6 wEr ;" 33333k@4021.6 33333k@ )@2836.8)@2836.8 BwEr <" )@2836.8 )@ R@2217.3R@2217.3 UKEr =" R@2217.3 R@B U ,| R = ,Mean `S!B>| @3978.3@`3978.3 uEB?" @3978.3 @ @5357.75@5357.75 uFB@" @5357.75 @ g@4455.5g@4455.5 uEBA" g@4455.5 g@ @3837.25@3837.25 BvFBB" @3837.25 @ ک@3309.05ک@3309.05 VLFBC" ک@3309.05 ک@B V ,| "C ,Maximum bQ!D| @5093@b5093 pCE" @5093 @ @5759@5759 rCF" @5759 @ fffff@4889.4fffff@4889.4 tEG" fffff@4889.4 fffff@ 3333@4837.73333@4837.7 BtEH" 3333@4837.7 3333@ 0@4400.80@4400.8 lB|WEI" 0@4400.8 0@B lElasticModulusAged >J (_ MPa_ ) U|@2zKCB| UMinimum ]S!>L| ̯@3415.9̯@]3415.9 wE>M" ̯@3415.9 ̯@ fffff@3828.7fffff@3828.7 wE>N" fffff@3828.7 fffff@ 33333Q@3752.633333Q@3752.6 wE>O" 33333Q@3752.6 33333Q@ l@2742.4l@2742.4 BwE>P" l@2742.4 l@ fffff7@2715.7fffff7@2715.7 i|TE>Q" fffff7@2715.7 fffff7@B i ;|&Q| ;Mean aT!R| ffffO@3495.95ffffO@a3495.95 vFS" ffffO@3495.95 ffffO@ ̌ذ@4312.55̌ذ@4312.55 uFT" ̌ذ@4312.55 ̌ذ@ I@4004.8I@4004.8 tEU" I@4004.8 I@ @3336.3@3336.3 BtEV" @3336.3 @ fffff@3663.7fffff@3663.7 i|TEW" fffff@3663.7 fffff@B i ;|&bW| ;Maximum bQ!RX| @3576@b3576 rCRY" @3576 @ fffff@4796.4fffff@4796.4 rERZ" fffff@4796.4 fffff@ @4257@4257 rCR[" @4257 @ fffff@3930.2fffff@3930.2 BtER\" fffff@3930.2 fffff@ 3333@4611.73333@4611.7 lB|WER]" 3333@4611.7 3333@B lYieldStrain  ^ AsCast(_ MPa_ ) U|@2j`XB| UMinimum \R! a| I +?0.011I +?\0.011 uD b" I +?0.011 I +? Mb?0.008Mb?0.008 vD c" Mb?0.008 Mb? gsu?0.0053gsu?0.0053 wE d" gsu?0.0053 gsu? ;Onr?0.0045;Onr?0.0045 BwE e" ;Onr?0.0045 ;Onr? UN@s?0.0047UN@s?0.0047 UKE f" UN@s?0.0047 UN@s?B U ,| vf ,Mean aT!Ng| :pΈҎ?0.01505:pΈҎ?a0.01505 vFNh" :pΈҎ?0.01505 :pΈҎ? X5;N?0.00845X5;N?0.00845 uFNi" X5;N?0.00845 X5;N? a+ey?0.0062a+ey?0.0062 uENj" a+ey?0.0062 a+ey? MSt$w?0.00565MSt$w?0.00565 BuFNk" MSt$w?0.00565 MSt$w? Ǻv?0.0056Ǻv?0.0056 UKENl" Ǻv?0.0056 Ǻv?B U ,| .l ,Maximum dS!m| jM?0.0191jM?d0.0191 tEn" jM?0.0191 jM? y):?0.0089y):?0.0089 tEo" y):?0.0089 y):? ZӼ}?0.0071ZӼ}?0.0071 tEp" ZӼ}?0.0071 ZӼ}? _Q{?0.0068_Q{?0.0068 BtEq" _Q{?0.0068 _Q{? 9vz?0.00659vz?0.0065 lBB|WEr" 9vz?0.0065 9vz?B lYieldStrain bs Aged(_ MPa_ ) U|@26umBB| UMinimum ]S!bv| L7A`?0.0165L7A`?]0.0165 wEbw" L7A`?0.0165 L7A`? S!uq{?0.0067S!uq{?0.0067 wEbx" S!uq{?0.0067 S!uq{? w?0.0058w?0.0058 wEby" w?0.0058 w? _vOv?0.0054_vOv?0.0054 BwEbz" _vOv?0.0054 _vOv? nt?0.0049nt?0.0049 `|KEb{" nt?0.0049 nt?B ` ;|&B{| ;Mean `S!|| y):?0.0178y):?`0.0178 uE}" y):?0.0178 y):?  QI}?0.00715 QI}?0.00715 vF~"  QI}?0.00715  QI}? ( 0y?0.00615( 0y?0.00615 vF" ( 0y?0.00615 ( 0y? Aǘv?0.00555Aǘv?0.00555 BuF" Aǘv?0.00555 Aǘv? I +v?0.0055I +v?0.0055 `|KE" I +v?0.0055 I +v?B ` ;B|&| ;Maximum dBS!^B| jM?0.0191jM?d0.0191 BtE^" jM?0.0191 jM?B ŏ1w-!?0.0076ŏ1w-!?0.0076 BtE^" ŏ1w-!?0.0076 ŏ1w-!?B 9vz?0.00659vz?0.0065 BtE^" 9vz?0.0065 9vz?B +eXw?0.0057+eXw?0.0057 BBtE^" +eXw?0.0057 +eXw?B HPx?0.0061HPx?0.0061##XX#T'##(9X#XUKI^" HPx?0.0061  HPx?BB U#; 9#(#r#(9 ;##XX9#(##7X#XSource:_ NIST_ Ԁand_ CSM_ , DatabaseforSolderPropertieswithEmphasisonNewLeadfreeSolders#V7#3##7V,#V7#i##7VԀFebruary2002,#V7###7V   R4c\O  5  (#V7###7V##XX7###7X#Xhttp://www.boulder.nist.gov/div853/lead%20free/props01.html#V7###XT"XV%##XXXXT"6I\]E*N*N  7e#7X#X)l##XX7#M##XT"XX#X##XXXXT"#&%X#X  .  9NB` ` _ X^ __##XX%#&##XT"XX#X#  @!   "p     N|l N ZZ` R   9NB)N Nl N)N)Nl)N 9NB   XXT"AppendixB#XT"X |# N  B N^  &M%XXT"Table1:QualitativePerformanceResults/CommentsforSelectLeadfreeSolderAlloyCompositions#XT"X%&MO#? p 3*dpdLdd Lkdd kUdd Udd dd ^dd ^dd k S%k S%,dd ,d ,dd ,Edd +  *BBB X *WXXT"   9NBk Xmb#<WAlloy Z CompositionNNNN `#  24      ABB,!l "BBB AComments EBBB0!Z"BB EReference#mXX<mb## IBBB6$Z "BBB Imb#<XmX#W<mb#5#TinCopper%mb#<W#mXX<mb## AB2$ N "BBB Amb#<XmX#W<mb#c#mb#<WEutecticSnCu#W<mb#8#mb#<W >/!  "B >L bcdefghiilxhVbcdefghiL Xk  b3    Xb32il3  0    Hasthehighestmeltingtemperature.b3݌   Ќ   b3   b32il3  0    IslowerintensilestrengthandhigherinelongationthanSnAgandSnPb.b3݌ B  Ќ   b3   b32il3  0    ShearstrengthiscomparablewithSnPb.b3݌T  Ќ   b3   b3b2il3  0    Creepstrengthishigherthan100SnbutlowerthanSnAgCu(at20and100oC).b3b݌  Ќ   b3   b32il3  0    TimetoruptureishigherthanSnAgCubutlowerthanSn40Pb(at25and100oC).b3݌R  Ќ   b3   b32il3  0    WettingpropertiescanpotentiallyreplaceSnPbinwaveand_ reflow_ Ԁprocesses.b3݌d  Ќ   b3   b32il3  0    _ Reflow_ ԀspreadingisbetterthanSnAgbutpoorerthaneutecticSnPb.b3݌  Ќ   b3   b32il3  0    Isgoodforwavesoldering.;#W<mb##mb#<Wb3݌b  Ќ   b3   b3 2il3  0    _ Wettability_ Ԁ(whenusingan_ unactivated_ Ԁflux)islowerthanSnPb.b3 7݌t Ќ   b3   b3A2il3  0    wHasfairlygoodfatigueresistance.b3Al݌  L9+$ L# U#P Vbcdefghihxbcdefghi PLauetal.#mXX<mb##mb#<XmX bBO!   ?1.?b1. [BLA   ?1. ?B [SnCu ;,!h"B ;L bcdefghiilxhVbcdefghiL b3   b32il3  0    Tensilestrengthdropswithincreasingtemperatures.b3݌h Ќ   b3   b3}2il3  0    IsweakerandmoreductilethanSnAgCuandSnPb.b3}݌ Ќ   b3   b3e2il3  0    CreepperformanceofSn0.5CuissimilartoSn37PbandpoorerthanSnAgCuat f 75oC.b3e݌  I6+x I#t#P Vbcdefghihxbcdefghi(PWilliam_ Plumbridge_ Ԁ(OpenUniversity) bBO!  @3.@b3. [BLAh  @3. @B [Sn0.7Cu ;,!Z "B ;L bcdefghiilxhVbcdefghiL b3   b32il3  0    Issuitableforhightemperatureapplications.b3݌Z! Ќ   b3   b32il3  0    Creep/fatiguedataissuperiortoSnPbbutinferiortoSnAgX.b3݌  I6+l " I##P VbcdefghihxbcdefghilPA_ Grusd_ ԀandC_ Jorgensen_ Ԁ(_ Heraeus_ Ԁ_ Cermalloy_ Ԁ&IPC) bBO!l $  @6.@b6. [BLAZ%  @6. @B [Sn0.7Cu ;,!N&"B ;L bcdefghiilxhVbcdefghiLL bcdefghiilxxbcdefghiL b3    b32il3  0    Isthebestchoiceforwavesoldering(alongwithSn3.5Ag).b3݌N' Ќ   b3   b32il3  0    Isundesirablefor_ reflow_ Ԁapplications.b3݌`( Ќ   b3   b32il3  0    IssimilartoeutecticSn37Pbforsurfacemountuse.b3݌  I6+) I##P bcdefghixxbcdefghiSPk Bathetal.(_ NEMI_ ) bBO!N*  @7.@b7.k jk  ^BOAN+  @7. @B ^SnCu >/!T,"B >L bcdefghiilxxbcdefghiLk V b3    b32il3  0    Highmeltingtemperatureprohibitsalloyusefortemperaturesensitiveapplications.b3݌T- Ќ   b3   b32il3  0    Demonstratespoorwettingalloy(ascomparedwithotherleadfreesolders).b3݌. Ќ   b3   b32il3  0    Hasalowcapillaryactiontodrawitintobarrelsduring_ PTH_ Ԁtechnology.b3݌R/ Ќ   b3   b32il3  0    Haspooroverallfatiguecharacteristics.b3݌d0 Ќ   b3   b32il3  0    Lacksthefatigueresistanceneededforsurfacemount.b3݌  1  b3   b32il3  0    Crackedduringmechanicalstrengthflextestingindicatingaweakjointunableto b2 withstandawiderangeofmechanicalstresses.Fb3݌  L9+t3 L#\#P bcdefghixxbcdefghiPk )K._ Seelig_ ԀandD._ Suraski_ Ԁ(AIM)k  k {{ bBO!R6  "@9."@ b9. [BLAT7  "@9. "@ B [Sn0.7Cu ;,! V8"B ;L bcdefghiilxxbcdefghiLL bcdefghiilxxbcdefghiLk x  b3    b3c 2il3  0    Iscosteffective.b3c  ݌ V9 Ќ   b3   b3D2il3  0    Isagoodalternativeforwavesolderingandhandsolderingapplications.b3Do݌h!: Ќ   b3   b3B2il3  0    Haspoorwetting.b3Bm݌  I6+"; IP bcdefghixxbcdefghi P k LeadFreeSolderingGuide(AIM) BB/! V< B#mXX<mb# #mb#<XmXk h !#mXX<mb#;#mb#<XmX BBB1! V=B hBSn3Cu =B,!\#>"BB =#mXX<mb##L bcdefghiilxxbcdefghiL b3   mb#<XmX#W<mb##mb#<W b32il3  0    Recommendedforhightemperatureapplicationsonly.b3݌ IB6+\#?B IЌ  #q#k %LeadFreeSolderingGuide(AIM) BBB/!\#@B B#mXX<mb##mb#<XmXk k {{#W<mb#R#mb#<W!#mXX<mb#b# B8&\#A h BB B @6$$b!B" @ @6$D&"C" @ @6$'b$D" @ @6$D)%E" @(N E;$*b'F" IE(N(N @6$*b'F" @(NNN*N,N,N,N,N*N*N*NNNNN IBBB4)D,(G" I  I  R     mb#<XmX     9NB 9NB#W<mb##mb#<WAlloy d Composition `#  25      ABB,!"BBB A#mXX<mb#H#mb#<XmXComments#mXX<mb#B#mb#<XmX EBBB0!d"BB EReference#mXX<mb## IBBB6$d"BBB Imb#<XmX @ #W<mb#F# @ Ό>WTinSilverCopper#W>Ό# @ mb#<W#mXX<mb#f# AB2$X"BBB Amb#<XmXSn3.5Ag0.9Cu >/!&"B >#mXX<mb##mb#<XmXk ~   b3   b32il3  0    TensilestrengthishigherthaneutecticSnPb.b3݌& Ќ   b3   b32il3  0    IshigherthanSnPbinyieldstrength,shearstrength,impactstrength,andcreep L resistance(alloysneareutecticSnAgCu).b3݌  Ќ   b3   b32il3  0    Tensilestrength,shearstrength,andmeltingtemperatureincreaseswhileelongation 6   decreases(alloysfurtherawayfromeutecticSnAgCu).b3 ݌  Ќ   b3   b38!2il3  0    Demonstratesthelongesttimetobreakincreeptests(Sn3.5Ag0.75Cu).b38!c!݌   Ќ   b3   b34"2il3  0    _ Wettability_ Ԁ(whenusingan_ unactivated_ Ԁflux)islowerthanSnPbbuthigherthanSn F   Cu.b34"_"݌  Ќ   b3   b3#2il3  0    Isaprevailingalternativetoleadcontainingsolder.b3##݌  #mXX<mb#v#mb#<XmX L9+   LLauetal. bBO!&  ?1.?b1. [BLA&  ?1. ?B [SnAgCu ;,! ` "B ; b3   b3%2il3  0    Isdifficulttoplasticallydeformandlesslikelytoharden.b3%&݌ `  Ќ   b3   b3&2il3  0    FatiguelifeislongerthanSnPb(sufficientfatigueresistanceforuseinelectronics   assembly).b3&'݌  I6+J  I_ Ochiai_ Ԁetal.(FujitsuLaboratoriesLtd.)U#W<mb#e#mb#<W bBO!   @2.@b2. [BLA `   @2. @B [SnAgCu#W<mb#(#mb#<W( ;,! "B ; b3   b3R*2il3  0    Displaysthesmallestelongationtofailure.b3R*}*݌  Ќ   b3   b33+2il3  0    IsstrongerthanSnCuandSnPb.*#W<mb#)#mb#<Wb33+^+݌>  Ќ   b3   b3n,2il3  0    HasmuchgreatercreepresistancethanSn37Pb.b3n,,݌d Ќ   b3   b3Q-2il3  0    HaslowercreepductilitythanSn37Pb.b3Q-|-݌ Ќ   b3   b3-.2il3  0    PotentiallythemostpopularleadfreealloyisSn3.8Ag0.7Cu(patented+#W<mb# ,#mb#<W#mXX<mb#{$#mb#<XmX).b3-.X.݌  I6+N IWilliam_ Plumbridge_ Ԁ(TheOpenUniversity).#W<mb#-/#mb#<W bBO!>   @3.@b3. [BLA !  @3. @B [Sn3Ag0.5Cu ;,!""B ; b3   b312il3  0    Tensilestrengthdecreaseswithincreasingtemperatureanddecreasingstrainrate.b311݌# Ќ   b3   b322il3  0    TensilestrengthissimilartoSn3.8Ag0.7Cu,andsuperiorthanSn3.5AgandSn B$ 0.5Cu(at103/sand348K).[0#W<mb#0#mb#<Wb322݌h% Ќ   b3   b3[42il3  0    CreepresistanceiscomparabletoSn3.8Ag0.7Cu#W<mb#3#mb#<W3ԀandsuperiortoSnAg.b3[44݌  I6+& IY._ Kariya_ ԀandW._ Plumbridge_ Ԁ(TheOpenUniversity) bBO!B(  @4.@b4. [BLA)  @4. @B [Sn3.5Ag0.5Cu ;,!\*"B ; b3   b3a72il3  0    MechanicalpropertiesarecomparablewithSn37Pbb3a77݌\+ Ќ   b3   b3F82il3  0    HasslightlylowerultimatetensilestrengthandyieldstrengththanSn37Pb.b3F8q8݌ , Ќ   b3   b3I92il3  0    CreepperformanceissuperiortoSn37Pb.b3I9t9݌F- Ќ   b3   b3':2il3  0    WettingpropertiesiscomparabletoSn37Pb.b3':R:݌l. Ќ   b3   b3;2il3  0    Hassimilarstaticviscosity,dynamicviscosity,tack,printability,solderability,wide / _ reflow_ Ԁwindowand_ reflow_ ԀcharacteristicsasSn37Pb.b3;3;݌  Ќ   b3   b3<2il3  0    HasalargerprintlifethanSn37Pb.b3<<݌|1 Ќ   b3   b3p=2il3  0    AlloypasteisusableinPCBapplications.b3p==݌  I6+,2 IShengetal.(_ OMG_ ԀAmericas) bBO! 4  @5.@b5. [BLA\5  @5. @B [Sn4Ag0.5Cu ;,!p6"B ; b3   b3?2il3  0    Iswellsuitedforhighoperationtemperatures(upto175oC).b3??݌p7 Ќ   b3   b3@2il3  0    Jointmechanicalstabilitydegradeswhenthemeltingpointisapproached.b3@@݌ 8 Ќ   b3   b3A2il3  0    DoesnotwetcopperaswellaseutecticSnPbwhenusingcommercialfluxes.b3AA݌  I6+Z9 IA._ Grusd_ ԀandC._ Jorgensen_ (_ Heraeus_ Ԁ_ Cermalloy_ ԀandIPC)R5#W<mb#5#mb#<W bBO! ;  @6.@b6. ]BLAp<  @6. @B ]Sn3.9Ag0.6CuC#W<mb#C#mb#<W =,! ="B =  L bcdefghiilxxbcdefghiL b3   b3E2il3  0    Isthepreferredchoicefor_ reflow_ Ԁsoldering.b3EE݌ > Ќ   b3   b3F2il3  0    Demonstratesadequatesolderability,yetinferiortoSnPb.b3FF݌N!? Ќ   b3   b3G2il3  0    InlinewiththeInternationalTinResearchInstitutealloyrangerecommendation,thus !t@ qualifyingforinternationalstandards.b3GG݌  I6+"$A IP bcdefghiilxxbcdefghiEP hEk ]7 Bathetal.(_ NEMI_ ) bBO! B  @7.@b7.}ӹ     9NB 9NBD#W<mb# E# k Imb#<Wk {{  ^BOAN!D  @7. @B ^#W<mb#EK#mb#<WSn3Ag0.5Cu #h E (LF218TM) >/!$!F"B > k dK  L bcdefghiilxxbcdefghiL b3!   b3 M2il3  0    Hasalowmeltingpointforaleadfreealloy.b3 M6M݌#h G Ќ   b3"   b3M2il3  0    LowestcostalloyfromtheSnAgCufamily.b3MN݌$!H Ќ   b3#   b3N2il3  0    BestwettingSnAgCualloy.b3NN݌R%!I Ќ   b3$   b3O2il3  0    Hasexcellentsolderjointreliability.b3OO݌&x"J Ќ   b3%   b3zP2il3  0    Iscompatiblewithallfluxtypes.b3zPP݌&(#K Ќ   b3&   b3QQ2il3  0    Hasexcellentmechanicalfatigueresistance.b3QQ|Q݌b'#L Ќ   b3'   b33R2il3  0    IsavirtualdropinforeutecticSnPbinwaveandhandsolderingapplications.b33R^R݌($M Ќ   b3(   b37S2il3  0    Produceslessdrossthanothersolderalloys,wetswell,andprovidessuperiorjoint (8%N strengthinwavesoldering.b37SbS݌  Ќ   b3)   b3gT2il3  0    Producesstrongersolderjoints,hasgreatermechanicalfatigueresistance,andisa "*&P virtualdropinfortheeutecticSnPbsolderinSMTapplications.b3gTT݌  Ќ   b3*   b3U2il3  0    Inlinewith_ JEIDA_ Ԁrecommendation.b3UU݌+'R Ќ   b3+   b3V2il3  0    Nocleansolderpastespassall_ Bellcore_ ԀandIPCspecifications.b3VV݌  L9+2,(S LP bcdefghiilxxbcdefghiLP Lk (= TechnicalDataSheet(AIM) bBO!#h T   @8. @b8. aBBBLA#h U   @8.  @B a#mXX<mb#o/#mb#<XmXbJ J  J  9NBJ 9NB5K#W<mb#K#mb#<WAlloy d  CompositionNNNN `#  26      ABB,!"BBB AComments EBBB0!d"BB EReference#mXX<mb#Y# IBBB6$d"BBB Imb#<XmX @ #W<mb#Z#RZ @ Ό>WTinSilverCopper#W>Ό\#\ @ mb#<W#mXX<mb#Q\#mb#<XmXԀ(Contd.)#mXX<mb#]# AB2$X"BBB Amb#<XmXSn3Ag0.5Cu * (LF218TM) >/!P"B > k bX  L bcdefghiilxxbcdefghiL b3,   b3+_2il3  0    Inlinewith_ JEIDA_ Ԁrecommendation.b3+_V_݌* Ќ   b3-   b3!`2il3  0    Lowestcostofpuremetalsforthisalloy.b3!`L`݌  L9+P  LP bcdefghiilxxbcdefghi^P ^k +d LeadFreeSolderingGuide(AIM) BB/!*  B! ;B,!* B ;Sn3.84Ag0.50.7Cu(_ TSC_ Ԅ4) ;,!~ "B ; k a  L bcdefghiilxxbcdefghiL b3.   b3Jc2il3  0    Hasalowmeltingpoint.b3Jcuc݌  Ќ   b3/   b3d2il3  0    Demonstratesgoodwetting.b3dBd݌ D Ќ   b30   b3d2il3  0    Demonstratesexcellentsolderjointreliability.b3de݌~  Ќ   b31   b3e2il3  0    Iscompatiblewithallfluxtypes.b3ee݌.  Ќ   b32   b3f2il3  0    Demonstratesexcellentmechanicalfatigueresistance.b3ff݌ T Ќ   b33   b3g2il3  0    IsavirtualdropinfortheeutecticSnPbsolderinSMTapplications.b3gg݌   Ќ   b34   b3h2il3  0    Inlinewiththe_ NEMI_ Ԁrecommendation.b3hh݌>  Ќ   b35   b3i2il3  0    Nocleansolderpastespassall_ Bellcore_ ԀandIPCspecifications.b3ii݌  I6+ d  IP bcdefghiilxxbcdefghibP bk i TechnicalDataSheet(AIM) bBO!    @8. @b8. [BLA    @8.  @B [Sn3.84Ag0.50.7Cu(_ TSC_ Ԅ4) ;,! "B ; k *k  L bcdefghiilxxbcdefghiL b36   b3m2il3  0    DemonstratessimilarcharacteristicsasCASTINandLF218TM.b3m?m݌2  Ќ   b37   b3n2il3  0    HighercostofmetalsthanCASTINandLF218TM.b3nDn݌X  Ќ   b38   b3o2il3  0    Presentsapotentialsilverphasechangeissues.b3oIo݌  I6+  IP bcdefghiilxxbcdefghilP lk s LeadFreeSolderingGuide(AIM) BB/!2  B! ;B,!2 B ;Sn3.5Ag0.5Cu ;,!L!"B ; k p  L bcdefghiilxxbcdefghiL b39   b3r2il3  0    HassimilarcharacteristicstoSn3Ag0.5Cub3rFr݌L" Ќ   b3:   b3r2il3  0    IsslightlyhighercostofmetalsthenSn3Ag0.5Cu.b3r%s݌  I6+# IP bcdefghiilxxbcdefghiqP qk 1 LeadFreeSolderingGuide(AIM) BB/!L$ B! k ytk s  =BB,!L%B =Sn4Ag0.5Cu =B,!@&"BB = k u  L bcdefghiilxxbcdefghiL b3;   b3/v2il3  0    Demonstratesgoodfatiguecharacteristics(superiorthermalfatigueresistanceas @' comparedtoSnCu).@]b3/vZv݌  Ќ   b3<   b3yw2il3  0    Hasgoodoveralljointstrength.b3yww݌*) Ќ   b3=   b3Nx2il3  0    Exhibitssomechangeingrainstructureduringthermalcycling..wb3Nxyx݌P* Ќ   b3>   b3ey2il3  0    Passedallmechanicalstrengthflextestrequirements.b3eyy݌+ Ќ  P bcdefghiilxxbcdefghiuPL bcdefghiilxxbcdefghiL b3?   b3z2il3  0    Sufficientsupplyofbasematerials.b3z{݌  y IB6+:,B IP bcdefghiilxxbcdefghizP uk {{ Karl_ Seelig_ ԀandDavid_ Suraski_ (AIM) bBBO!z.B  "@9."@b9. fBBBSA@/  "@9. "@BB f @  Y  Z  9NB(Z 9NB TinSilverCopperBismuth #W<mb#P]#{ @  @ mb#<W CBB2$~0"BBB C 9NB5~  ~ }  }R9NB UR 5RSnAgCuBi @B/!N1"BB @ k }| b3@   b32il3  0    Surfacetension,electricalresistivity,anddensityarecomparablewithSnAg,SnAg N2 CuandSnAgCuX.b30݌3 Ќ   b3A   b3<2il3  0    DemonstratessuperiorhardnesstoSnPb.b3<g݌d4 Ќ   b3B   b32il3  0    Hashighertensileandyieldstrengths,lowerelongation,andaslowercreepratethan *5 SnPb.b3C݌  Ќ   b3C   b372il3  0    WettingbehaviorisfairlycomparablewithSn37Pb(with1or2%Bicontent).b37b݌,7 Ќ   b3D   b392il3  0    Outstandingincreepresistanceandwetting.b39d݌  JB9+|8B Jk 1 Lauetal.~#W<mb#~# k Emb#<Wk i  bBBO!N9B  ?1.?b1.#mXX<mb#^#mb#<XmXQGEN:  ?1. ! ?BB Q #W<mb###XT"XW#&M%XXT"  #XT"X%&MA#؅ mXXXXT"`Y  } 9NBcƇ#XT"XXmX# k }   h   9NBmXXXXT" k {{ mb#<XmX #mXX<mb#I##XT"XXmX#  <c ̈  ڈ  9NB 9NB k 0mXXXXT"mb#<XmXk i   ^">  #mXX<mb##  #XT"XXmX#׊ 9NBj B "mXXXXT"mRXmX 9NB  M*N|*NReferences#mXXRm#m&%XmX   L Vbcdefghi]AhxbcdefghiL 9NBP 9NB k $X $#mXX%m&#m(9XmX   b3E   b3v2]A3  0 /   AIM: AIMLeadFreeSolderingGuide:Alloys,Chemistries,Data,Experience,Consultation, \  ) (ćhttp://_ www.aimsolder.com_ /_ techarticles_ /AIM%20lead-free%20guide.pdf?section=assembly#; 9m(##XT"X ;5#mXXXXT"m(9XmX)b3v݌y/p%/p% Ќ  #; 9m(o##XT"X ;#mXXXXT"m(9XmX b3F   b3x2]A3  0 /   AIM: TechnicalDataSheet:TechnicalArticles:LeadfreeProductDataSheets,   4U/\O  5  (Ǝhttp://www.aimsolder.com/leadfree_tdss.cfm?section=assembly6S\OgXg  7#))b3x݌h  /p%/p% Ќ  #; 9m(:##XT"X ;Y#; XXT"m(9 ; b3G   b3P2]A3  0 /   Bath,_ Jasbir_ ,Carol_ Handwerker_ ,EdwinBradley#; 9m(1#m(9 ;,May2000: ResearchUpdate:LeadFreeSolderAlternatives,CircuitsAssembly    4G/\O  5  (,www.circuitassembly.com6ݑ\Omak  7ll= ),p.3140.b3P{݌W  /p%/p% Ќ   b3H   Qhb32]A3  0 /   #; 9m(Q#Chris_ Jorgensen_ ,September1999#XT"X ;#; XXT": LeadFreeElectronicsAssemblies:_ Roadmapping_ ԀaSmoothTransition,_ Circuitree_ ,p.102106#XT"X ;#mXXXXT"m(9XmX.b3O݌ /%/% Ќ   b3I   b32]A3  0 /   _ Grusd_ #; 9m(#m(9 ;,AngelaandChris_ Jorgensen_ #; 9m(?#m(9 ;,September1999#; 9m(ɖ#m(9 ;: LeadFREEAlloys:FittingtheSquarePegintheSquareHole,_ Circuitree_ ,   p.98102.b3݌o /%/% Ќ   b3J   b32]A3  0 /   _ Kariya_ Ԁ#; 9m(#m(9 ;,_ Yoshiharu_ ԀandWilliamJ._ Plumbridge_ :#; 9m(Ϙ#m(9 ;Ԁ MechanicalPropertiesofSn3.0mass%Ag0.5%mass%CuAlloy,Materials   EngineeringDepartment,TheOpenUniversity,U.K.b3?݌ /%/% Ќ   b3K   b3b2]A3  0 /   Lau,JohnH.,C.P.Wong,_ Ning_ ԄChengLee,and_ S.W._ Ԁ_ Ricky_ ԀLee#; 9m(v#m(9 ;,September2000#; 9m(#m(9 ;: ElectronicsManufacturingWithLeadFree,  HalogenFree&ConductiveAdhesiveMaterials,_ McGraw_ ԄHill,Ch.13:PrevailingLeadFreeAlloys,p.13.113.62.b3b݌M/%/% Ќ   b3L   b392]A3  0 /   NationalInstituteofStandards&Technology(_ NIST_ )andColoradoSchoolofMines(_ CSM_ )#; 9m(#m(9 ;,February11,2002(lastupdated)#; 9m(c#m(9 ;: v  DatabaseforSolderPropertieswithEmphasisonNewLeadfreeSoldersRelease4.0#; 9m(Ǟ#m(9 ;,PropertiesofLeadFreeSolders < 4fo/\O  5  (http://www.boulder.nist.gov/div853/lead%20free/props01.html6П\Odun  7fo).#; 9m(x#m(9 ;b39d݌x/%/% Ќ   b3M   b3e2]A3  0 /   _ Ochiai_ ,_ Masayuki_ #; 9m(#m(9 ;,_ Toshiya_ Ԁ_ Akamatsu_ ,_ Hidefumi_ Ԁ_ Ueda_ #; 9m(I#m(9 ;,June2002#; 9m(,#m(9 ;: ReliabilityofSolderJointsAssembledwithLeadFree + Solder,FujitsuScienceTechnologyJournal,38,1,p.96101.b3e݌g/%/% Ќ   b3N   b3s2]A3  0 /   _ Plumbridge_ #; 9m(y#m(9 ;,WilliamJ.#; 9m(1#m(9 ;,2001: TheSolder_ Programme_ ԀattheOpenUniversityMaterialsEngineeringDepartment:AnUpdate,   2001",MaterialsEngineeringDepartment,TheOpenUniversity,UK,4ɕ\O  5  http://technology.open.ac.uk/materials/mathp.html6y\O  7#b3s݌V!/%/% Ќ   b3O   b32]A3  0 /   _ Quan_ ԀSheng,CharlesBradshaw,Sandy_ Kwiatek_ #; 9m(#m(9 ;,2002: PropertiesofLeadFreeAlloyandPerformancePropertiesofLeadFree  # NoCleanSolderPaste,PresentedatIPC_ SMEMA_ ԀCouncilAPEX2002(www.goapex.org).b3ħ݌E$/%/% Ќ  #mXX9m( #m(9XmX b3P   b3'2]A3  0 /   _ Seelig_ ,Karl#; 9m(#m(9 ;*&-v%andDavid_ Suraski_ : #; 9m(#m(9 ;MaterialsandProcessConsiderationsforLeadFreeElectronicsAssembly,4%\O  5  AIM:Leadfree n& ArticlesK,(http://www.aimsolder.com/lead_free.cfm?section=articles#26\OX#  7%>)#; 9m(##XT"X ;#mXXXXT"mRXmXb3'R݌4'/%/% Ќ  % X%j r dL Vbcdefghi]AhhVbcdefghiLQ# Rm##XT"X ­# 0* * Ap)/E K#dE/E K#A 9NB  ɾ9NB-N-N