The Lead-Free Solder Project LFSP mini-site pages:  Introduction   |   Project Information   |   Project Documents The Lead-free Solder Project (LFSP) is a voluntary, cooperative project that has been initiated by the Design for the Environment (DfE) Program of the U.S. Environmental Protection Agency's (EPA) Office of Pollution Prevention and Toxics, the University of Tennessee (UT) Center for Clean Products and Clean Technologies, INTERESTING CONNECTIONS The following are links are to a 3 part series on electronics recycling in the San Jose Mercury News (Nov 24-26, 2002; found on bayarea.com). Great reading. The intro page for the 3 articles Article #1: "Where computers go to die" (html backup of online article) Article #2: "Cheap products' human cost" (html backup of online article) Article #3: "Recycling solutions for PCs are limited and face obstacles" (html backup of online article) the Electronic Industries Alliance (EIA), the IPC–Association Connecting Electronics Industries (IPC), individual electronics industry companies, and a high-tech research group (SEMATECH). The purpose is to objectively assess the environmental life-cycle impacts of selected lead-free solders as alternatives to tin-lead solder. The DfE LFSP analysis also intends to provide an assessment of recyclability and leachability of the solders, as well as a baseline life-cycle assessment (LCA) of the tin-lead and lead-free alternative solders. Project partners include electronics manufacturers and assemblers, trade associations, academic and research organizations, and public interest groups. The current list of contributing industry partners includes: Agilent, Cookson Electronics, Delphi Delco, Hewlett-Packard, IBM, Intel, Pitney Bowes, Rockwell Collins, Sematech, and Thomson Multimedia. Other partners include UT, EIA, IPC, and the Silicon Valley Toxics Coalition. Additional participants are welcome. Specific goals of the project include: evaluating the environmental impacts of tin/lead solder and selected lead-free alternative solders, evaluating the effects of lead-free solders on recycling and reclamation at the end of the electronic product life-cycle, and assessing the leachability of lead-free solders and their potential environmental effects. For more information including contact info, see the Project Information page. Also, see the U.S. EPA's >DfE Web site for the LFSP. Welcome  ::  About Us  ::  Publications  ::  Projects  ::  Staff  ::  Links  ::  EPR  ::  Contact Us  ::  Top

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